Footprints

505 footprints matching “SO-8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

505 footprints · page 1 of 22

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SO-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf)

Pads: 8
SMD: 7.4×5.4
Boards: 380

SO-8C

FP—

muratovas-MAS_Package_std

Pads: 7
SMD: 7.4×5.4
Boards: —

SOIC-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)

Pads: 8
SMD: 7.4×5.4
Boards: 3,516

DIP-8_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 8
THT: 9.7×10.7
Boards: 956

MSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)

Pads: 8
SMD: 6.4×3.5
Boards: 348

DIP-8_W7.62mm_Socket

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 8
THT: 10.7×10.8
Boards: 322

DIP-8_W7.62mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 8
THT: 10.5×10.7
Boards: 242

TSSOP-8_4.4x3mm_P0.65mm

FP3D

Package_SO

TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 8
SMD: 7.7×3.5
Boards: 179

DIP-8_W7.62mm_Socket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×10.8
Boards: 178

VSSOP-8_2.3x2mm_P0.5mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads: 8
SMD: 4.6×2.5
Boards: 156

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 135

SOT-23-8

FP3D

Package_TO_SOT_SMD

SOT, 8 Pin (JEDEC MO-178 Var BA https://www.jedec.org/document_search?search_api_views_fulltext=MO-178)

Pads: 8
SMD: 4.1×3.4
Boards: 128

Oscillator_DIP-8

FP3D

Oscillator

Oscillator, DIP8,http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf

Pads: 4
THT: 13.2×13.2
Boards: 120

Bosch_LGA-8_2.5x2.5mm_P0.65mm_ClockwisePinNumbering

FP3D

Package_LGA

LGA-8

Pads: 8
SMD: 2.8×3.1
Boards: 118

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads: 8
SMD: 5.9×3.6
Boards: 111

TI_SO-PowerPAD-8_ThermalVias

FP—

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf

Pads: 9
SMD: 7.5×5.5
Boards: 103