Footprints

86 footprints matching “SOP-8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

86 footprints · page 1 of 4

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SOP-8_3.76x4.96mm_P1.27mm

FP—

Package_SO

SOP, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf)

Pads: 8
SMD: 7.6×5.5
Boards: 44

SOP-8_6.62x9.15mm_P2.54mm

FP—

Package_SO

SOP, 8 Pin (http://www.ti.com/lit/ds/symlink/iso1050.pdf)

Pads: 8
SMD: 11.9×9.7
Boards: 43

SOP-8_6.605x9.655mm_P2.54mm

FP3D

Package_SO

SOP, 8 Pin (https://www.onsemi.com/pdf/datasheet/hcpl2631m-d.pdf)

Pads: 8
SMD: 11.5×10.2
Boards: 3

SOP-8-1EP_4.57x4.57mm_P1.27mm_EP4.57x4.45mm

FP—

Package_SO

SOP, 8 Pin (https://ww2.minicircuits.com/case_style/XX112.pdf)

Pads: 9
SMD: 11.7×5.1
Boards: 2

SOP-8-1EP_4.57x4.57mm_P1.27mm_EP4.57x4.45mm_ThermalVias

FP—

Package_SO

SOP, 8 Pin (https://ww2.minicircuits.com/case_style/XX112.pdf)

Pads: 9
SMD: 11.7×5.1
Boards: 1

MSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)

Pads: 8
SMD: 6.4×3.5
Boards: 348

TSSOP-8_4.4x3mm_P0.65mm

FP3D

Package_SO

TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 8
SMD: 7.7×3.5
Boards: 179

VSSOP-8_2.3x2mm_P0.5mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads: 8
SMD: 4.6×2.5
Boards: 156

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads: 8
SMD: 5.9×3.6
Boards: 111

SSOP-8_2.95x2.8mm_P0.65mm

FP3D

Package_SO

SSOP-8 2.9 x2.8mm Pitch 0.65mm

Pads: 8
SMD: 5.5×3.3
Boards: 57

Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias

FP3D

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf

Pads: 9
SMD: 8.4×5.5
Boards: 47