Footprints

17 footprints matching “TO-5-6”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

17 footprints

Matched by name and keywords. Search by meaning instead

TO-5-6

FP—

Package_TO_SOT_THT

TO-5-6

Pads: 6
THT: 9.9×9.9
Boards: —

TO-5-6_Window

FP—

Package_TO_SOT_THT

TO-5-6, Window

Pads: 6
THT: 9.9×9.9
Boards: —

SO-5-6_4.55x3.7mm_P1.27mm

FP3D

Package_SO

SO, 5 Pin (https://toshiba.semicon-storage.com/us/semiconductor/design-development/package/detail.5pin%20SO6.html)

Pads: 5
SMD: 8.0×4.2
Boards: 6

DIP-5-6_W7.62mm

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils)

Pads: 5
THT: 9.8×8.2
Boards: 1

SMD-5-6_3.83x2.79mm

FP—

digikey-digikey-footprints

Pads: 5
SMD: 4.3×5.3
Boards: —

SMD-5-6_R_3.83x2.79mm

FP—

digikey-digikey-footprints

Pads: 5
SMD: 4.3×5.3
Boards: —

SMD-5-6_3.83x2.79mm

FP—

digikey-Source_Footprints

Pads: 5
SMD: 4.3×5.3
Boards: —

SMD-5-6_R_3.83x2.79mm

FP—

digikey-Source_Footprints

Pads: 5
SMD: 4.3×5.3
Boards: —

DIP-5-6_W10.16mm

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils)

Pads: 5
THT: 12.3×8.2
Boards: —

DIP-5-6_W10.16mm_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads

Pads: 5
THT: 13.2×8.2
Boards: —

DIP-5-6_W7.62mm_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads

Pads: 5
THT: 10.6×8.2
Boards: —

DIP-5-6_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads

Pads: 5
SMD: 10.7×8.3
Boards: —

DIP-5-6_W7.62mm_Socket

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket

Pads: 5
THT: 10.7×8.3
Boards: —

DIP-5-6_W7.62mm_Socket_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads

Pads: 5
THT: 10.7×8.3
Boards: —

DIP-5-6_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads

Pads: 5
SMD: 12.5×8.3
Boards: —

SOIC-5-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

SOIC, 5 Pin (JEDEC MO-155, variation AA, 2.50mm nominal body thickness, https://www.jedec.org/system/files/docs/Mo-155a.pdf)

Pads: 5
SMD: 8.4×4.1
Boards: —

Toshiba_SOIC-5-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

Toshiba SOIC, 5 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.5pin%20MFSOP6.html)

Pads: 5
SMD: 8.0×4.1
Boards: —