Footprints

39 footprints matching “VSON”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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39 footprints · page 1 of 2

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VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias

FP3D

Package_SON

VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument

Pads: 11
SMD: 4.3×4.3
Boards: 17

VSON-8_3.3x3.3mm_P0.65mm_NexFET

FP3D

Package_SON

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf

Pads: 5
SMD: 4.0×3.8
Boards: 16

VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm

FP3D

Package_SON

VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument

Pads: 11
SMD: 4.3×4.3
Boards: 14

VSON-8-1EP_3x3mm_P0.65mm_EP1.65x2.4mm

FP—

Package_SON

VSON, 8 Pin (https://www.ti.com/lit/ds/symlink/tlv767-q1.pdf#page=31)

Pads: 9
SMD: 4.3×3.5
Boards: 13

VSONP-8-1EP_5x6_P1.27mm

FP—

Package_SON

SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf)

Pads: 3
SMD: 6.8×5.4
Boards: 7

VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm

FP3D

Package_SON

VSON, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20))

Pads: 11
SMD: 4.3×3.5
Boards: 5

VSON-14-1EP_3x4.45mm_P0.65mm_EP1.6x4.2mm_ThermalVias

FP—

Package_SON

VSON, 14 Pin (https://www.ti.com/lit/ds/symlink/lp8868x-q1.pdf#page=45)

Pads: 15
SMD: 4.3×5.0
Boards: 2

VSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm

FP—

Package_SON

VSON, 8 Pin (https://www.ti.com/lit/ds/symlink/thvd1450.pdf#page=37)

Pads: 9
SMD: 4.3×3.5
Boards: 2

VSON-14-1EP_3x4.45mm_P0.65mm_EP1.6x4.2mm

FP—

Package_SON

VSON, 14 Pin (https://www.ti.com/lit/ds/symlink/lp8868x-q1.pdf#page=45)

Pads: 15
SMD: 4.3×5.0
Boards: 1

VSON-10-1EP_3x3mm

FP—

digikey-digikey-footprints

Pads: 11
SMD: 4.3×4.3
Boards: —

VSON-10-1EP_3x3mm

FP—

digikey-Source_Footprints

Pads: 11
SMD: 4.3×4.3
Boards: —

VSONHR-6-1EP-1.5x1.5_P0.5

FP3D

muratovas-MAS_Package_nostd

Pads: 6
SMD: 2.0×2.0
Boards: —

VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm_ThermalVias

FP3D

Package_SON

VSON, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20))

Pads: 11
SMD: 4.3×3.5
Boards: —

VSON-8_1.5x2mm_P0.5mm

FP—

Package_SON

VSON, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62840.pdf#page=37)

Pads: 8
SMD: 2.2×2.5
Boards: —

VSON-8-1EP_3x3mm_P0.65mm_EP1.65x2.4mm_ThermalVias

FP—

Package_SON

VSON, 8 Pin (https://www.ti.com/lit/ds/symlink/tlv767-q1.pdf#page=31)

Pads: 9
SMD: 4.3×3.5
Boards: —

Texas_DRC0010J_ThermalVias

FP—

Package_SON

Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf

Pads: 11
SMD: 3.9×3.9
Boards: 45

Texas_S-PVSON-N10_ThermalVias

FP3D

Package_SON

3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf

Pads: 11
SMD: 4.3×4.3
Boards: 21

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9