Footprints

112 footprints matching “flat”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

112 footprints · page 1 of 5

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TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads: 44
SMD: 13.3×13.3
Boards: 335

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads: 144
SMD: 23.3×23.3
Boards: 104

LED_D3.0mm_FlatTop

FP3D

LED_THT

LED, Round, Flat Top, diameter 3.0mm, 2 pins, https://www.kingbright.com/attachments/file/psearch/000/00/00/L-47XEC(Ver.14A).pdf, generated by kicad-footprint-generator

Pads: 2
THT: 4.8×4.4
Boards: 64

DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 55

Pin_D0.7mm_L6.5mm_W1.8mm_FlatFork

FP3D

Connector_Pin

solder Pin_ with flat fork, hole diameter 0.7mm, length 6.5mm, width 1.8mm

Pads: 1
THT: 2.8×2.4
Boards: 48

Diodes_PowerDI3333-8

FP3D

Package_SON

Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf

Pads: 5
SMD: 4.2×3.8
Boards: 33

L_Murata_DFE201610P

FP3D

Inductor_SMD

Inductor, Murata, DFE201610P, 2.0x1.6x1.0mm, (https://www.murata.com/~/media/webrenewal/products/inductor/chip/tokoproducts/wirewoundmetalalloychiptype/m_dfe201610p.ashx)

Pads: 2
SMD: 2.5×2.1
Boards: 32

DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_DFN_QFN

6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 7
SMD: 3.3×2.5
Boards: 32

LED_D5.0mm_FlatTop

FP3D

LED_THT

LED, Round, Flat Top, diameter 5.0mm, 2 pins, https://www.kingbright.com/attachments/file/psearch/000/00/watermark00/L-483GDT(Ver.12B).pdf, generated by kicad-footprint-generator

Pads: 2
THT: 6.5×6.5
Boards: 25

DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.2×2.6
Boards: 18

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 18

Pin_D0.9mm_L10.0mm_W2.4mm_FlatFork

FP3D

Connector_Pin

solder Pin_ with flat fork, hole diameter 0.9mm, length 10.0mm, width 2.4mm

Pads: 1
THT: 3.4×2.8
Boards: 17

LED_D2.0mm_W4.8mm_H2.5mm_FlatTop

FP3D

LED_THT

LED, Round, Flat Top, Rectangular, size 4.8x2.5mm, diameter 2.0mm, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/20160808bak/L-13GD(Ver.9B).pdf, generated by kicad-footprint-generator

Pads: 2
THT: 5.4×3.1
Boards: 17

VSON-8_3.3x3.3mm_P0.65mm_NexFET

FP3D

Package_SON

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf

Pads: 5
SMD: 4.0×3.8
Boards: 16

DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 15

TO-92Flat

FP3D

Package_TO_SOT_THT

TO-92Flat package, often used for hall sensors, drill 0.75mm (see e.g. http://www.ti.com/lit/ds/symlink/drv5023.pdf)

Pads: 3
THT: 4.5×2.1
Boards: 12

DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm

FP3D

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 11
SMD: 4.3×3.7
Boards: 11

Pin_D1.4mm_L8.5mm_W2.8mm_FlatFork

FP3D

Connector_Pin

solder Pin_ with flat with fork, hole diameter 1.4mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434

Pads: 1
THT: 3.8×3.6
Boards: 10

L_Wuerth_HCI-1040

FP3D

Inductor_SMD

Inductor, Wuerth, HCI-1040, 10.2x10.2x4.0mm, (https://www.we-online.com/components/products/datasheet/744355215.pdf)

Pads: 2
SMD: 12.0×10.7
Boards: 9

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

LQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)

Pads: 128
SMD: 17.3×17.3
Boards: 9

Allegro_QFN-12-10-1EP_3x3mm_P0.5mm

FP—

Sensor_Current

Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx)

Pads: 10
SMD: 4.2×4.3
Boards: 9