Footprints

848 footprints matching “power”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

848 footprints · page 1 of 36

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PowerPAK_SO-8_Single

FP—

Package_SO

PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf)

Pads: 5
SMD: 7.1×5.5
Boards: 41

PowerIntegrations_SO-8

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf

Pads: 8
SMD: 8.0×5.4
Boards: 13

PowerPAK_SO-8_Dual

FP—

Package_SO

PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf)

Pads: 6
SMD: 7.1×5.5
Boards: 6

PowerPAK_SO-8L_Single

FP—

Package_SO

PowerPAK SO-8L Single (https://www.vishay.com/docs/64721/an913.pdf)

Pads: 5
SMD: 7.8×6.8
Boards: 4

PowerIntegrations_SMD-8

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 8
SMD: 11.1×10.7
Boards: 3

PowerIntegrations_SO-8C

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf

Pads: 7
SMD: 7.4×5.4
Boards: 3

PowerIntegrations_SMD-8B

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
SMD: 11.1×10.7
Boards: 2

PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm_ThermalVias

FP3D

Package_SO

PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)

Pads: 17
SMD: 7.3×5.4
Boards: 1

PowerFLAT-5x6

FP—

agg-agg

Pads: 6
SMD: 5.9×7.1
Boards: —

PowerPair-3x3

FP—

agg-agg

Pads: 5
SMD: 3.5×3.8
Boards: —

PowerPAK-1212-8

FP—

agg-agg

Pads: 3
SMD: 4.4×3.8
Boards: —

PowerPAK-SC-75-6L-Single

FP—

agg-agg

Pads: 3
SMD: 2.1×2.2
Boards: —

PowerPAK-SO-8

FP—

agg-agg

Pads: 3
SMD: 7.1×5.7
Boards: —

PowerSOIC-8_W3.9mm

FP—

digikey-digikey-footprints

Pads: 9
SMD: 5.4×8.5
Boards: —

PowerSOIC-8_W3.9mm

FP—

digikey-Source_Footprints

Pads: 9
SMD: 5.4×8.5
Boards: —

Power_inductor_SMD_0530

FP—

muratovas-MAS_Package_std

Power inductor SMD 0530 (5.4x5.2x3mm)

Pads: 2
SMD: 6.6×5.6
Boards: —

PowerIntegrations_eDIP-12B

FP3D

Package_DIP

Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf

Pads: 11
THT: 12.1×10.8
Boards: —

PowerIntegrations_PDIP-8B

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_PDIP-8C

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_SDIP-10C

FP3D

Package_DIP

PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf

Pads: 9
THT: 10.6×13.3
Boards: —

PowerIntegrations_SMD-8C

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
SMD: 11.1×10.7
Boards: —