Footprints
694 footprints matching “thermal”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TI_SO-PowerPAD-8_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 103
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 60
Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf
- Pads
- 9
- SMD
- 8.4×5.5
- Boards
- 47
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 47
Texas_DRC0010J_ThermalVias
Package_SON
Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf
- Pads
- 11
- SMD
- 3.9×3.9
- Boards
- 45
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 40
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias
Package_SO
SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 38
Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias
Package_SO
Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 34
VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias
Package_DFN_QFN
VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 33
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 31
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 28
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 24
VQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
VQFN, 24 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/product-documents/package-drawings/24L-VQFN%E2%80%934x4x0.9mm-MJ-C04-00143b.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 22
QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias
Package_DFN_QFN
QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)
- Pads
- 57
- SMD
- 8.3×8.3
- Boards
- 21
Texas_S-PVSON-N10_ThermalVias
Package_SON
3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 21
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 20
WSON-12-1EP_3x2mm_P0.5mm_EP1x2.65_ThermalVias
Package_SON
WSON-12 http://www.ti.com/lit/ds/symlink/lm27762.pdf
- Pads
- 13
- SMD
- 2.9×3.5
- Boards
- 18
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 17
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 16
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 16
QFN-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 15
QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 15
TO-277A
Package_TO_SOT_SMD
Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf
- Pads
- 3
- SMD
- 5.3×7.3
- Boards
- 15
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 14