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Reference layout

BREAD BOARD4

FHafting-BREAD-board4-BREAD-layout

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FHafting-BREAD-board4-BREAD-layout

The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).

48Placed parts
53Nets
2Copper layers
70 × 100 mmBoard size
yesRouted
KiCad 7File format

Bill of materials

48 distinct parts

26 resolve to something in the catalog — click through to the footprint.

RefValueFootprintQty
A1Arduino_Nano_v3.xModule:Arduino_Nano
C122uFCapacitor_SMD:C_1206_3216Metric
C2100nFCapacitor_SMD:C_1206_3216Metric
C322uFCapacitor_SMD:C_1206_3216Metric
C422uFCapacitor_SMD:C_1206_3216Metric
C50.01 uFCapacitor_SMD:C_1206_3216Metric
C60.01 uFCapacitor_SMD:C_1206_3216Metric
D1WS2812B_5050SparkFun-LED:WS2812-5050-4PIN
D2General_Purpose_DiodeDiode_THT:D_DO-35_SOD27_P7.62mm_Horizontal
D3General_Purpose_DiodeDiode_THT:D_DO-35_SOD27_P7.62mm_Horizontal
F110ASparkFun-Fuse:Glass Fuse Clip 5x20MM
F210ASparkFun-Fuse:Glass Fuse Clip 5x20MM
FB1Ferrite_Bead_SmallResistor_SMD:R_1206_3216Metric
FB2Ferrite_Bead_SmallResistor_SMD:R_1206_3216Metric
FB3Ferrite_Bead_SmallResistor_SMD:R_1206_3216Metric
FB4Ferrite_Bead_SmallResistor_SMD:R_1206_3216Metric
H1MountingHoleMountingHole:MountingHole_5mm
H2MountingHoleMountingHole:MountingHole_5mm
H3MountingHoleMountingHole:MountingHole_5mm
H4MountingHoleMountingHole:MountingHole_5mm
HS1Heatsink_PadSparkFun-Fuse:Thermal Pad
J1Conn_01x10_FemaleConnector_PinSocket_2.54mm:PinSocket_1x10_P2.54mm_Horizontal
J10Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
J11Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_3.5mm_H_PC
J12Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_3.5mm_H_PC
J13Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
J14Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
J15Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
J16Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
J17Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
J18Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
J2I2C_01x04Connector_JST:JST_SH_SM04B-SRSS-TB_1x04-1MP_P1.00mm_Horizontal
J3Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_3.5mm_H_PC
J4Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_3.5mm_H_ENDCAP_PC
J5Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_ENDCAP_PC_HVRELAY
J6Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
J7Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
J8Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
J9Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAY
K1G5Q-1Relay_THT:Relay_SPDT_Omron-G5Q-1
Show the other 8
K2G5Q-1Relay_THT:Relay_SPDT_Omron-G5Q-1
L14.7uHInductor_SMD:L_1210_3225Metric
Logo1Logo_Open_Hardware_SmallSymbol:OSHW-Symbol_6.7x6mm_SilkScreen
U1~Package_TO_SOT_SMD:TSOT-23-6
U2TCMT1100Package_SO:SOP-4_4.4x2.6mm_P1.27mm
U3MAX6675ISA+MAX6675ISA_:SOIC127P600X175-8N
U4MAX6675ISA+MAX6675ISA_:SOIC127P600X175-8N
U5TCMT1100Package_SO:SOP-4_4.4x2.6mm_P1.27mm

Provenance

Commit
unknown
Licence
CC-BY-4.0

How it is used

Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.