NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm

Package_BGA

4 × 4 × 0.87 mm, measured from the model's own geometry.

3D model

STEP

NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm

4 × 4 × 0.87 mm

66 KB STEP

Format: STEP
Size: 66 KB
Stored as: STEP, zstd-compressed

Footprints that name it

1

NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mmPackage_BGA

Land patterns

Footprints this model sits on

NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm

Package_BGA

NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf

Pads: 59
SMD: 6.0×6.0
Boards: —

Provenance

Source: kicad-packages3d
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception