PowerIntegrations_SMD-8

Package_DIP

8.95 × 10.24 × 3.68 mm, measured from the model's own geometry.

3D model

STEP

8.95 × 10.24 × 3.68 mm

244 KB STEP

Format: STEP
Size: 244 KB
Stored as: STEP, zstd-compressed

Footprints that name it

PowerIntegrations_SMD-8Package_DIP

Land patterns

Footprints this model sits on

PowerIntegrations_SMD-8

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 8
SMD: 11.1×10.7
Boards: 3

Provenance

Source: kicad-packages3d
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception