ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

Package_SO

6.40 × 6.50 × 1.10 mm, measured from the model's own geometry.

3D model

STEP

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

6.40 × 6.50 × 1.10 mm

268 KB STEP

Format: STEP
Size: 268 KB
Stored as: STEP, zstd-compressed

Footprints that name it

1

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mmPackage_SO

Land patterns

Footprints this model sits on

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 21
SMD: 7.9×7.1
Boards: 7

Provenance

Source: kicad-packages3d
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception