HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Footprint

21 pads

Mount: Surface mount
Courtyard: 15.9 × 16.6 mm
Pads: 21
File: 11 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

1 component in the catalog place this footprint

ADA4870ARRZ

SYMFP—

Amplifier_Operational

High Speed, High Voltage, 1A Output Drive Amplifier, PSOP-20

Pins: 21
Pads: 21
SMD: 15.9×16.6

On real boards

The largest boards that carry it

Design	Parts	Nets	Layers	Board	Licence	Source
Irrigation System V2	115	122	2	121.5 × 115 mm	CC-BY-4.0	Lawrence4U/Irrigation-System-v2 ↗
TLE7209-2R Module	13	13	2	43 × 22 mm	CC-BY-4.0	rusefi/hw_modular ↗

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception