HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm
Package_SO
8.30 × 11 × 1.60 mm, measured from the model's own geometry.
3D model
STEPHTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm
8.30 × 11 × 1.60 mm
414 KB STEP
- Format
- STEP
- Size
- 414 KB
- Stored as
- STEP, zstd-compressed
Footprints that name it
2Land patterns
Footprints this model sits on
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
FP3D
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
FP3D
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
Provenance
- Source
- kicad-packages3d
- Credit
- KiCad Libraries Contributors
- Licence
- CC-BY-SA-4.0-with-KiCad-exception