PQFN-8-EP_6x5mm_P1.27mm_Generic

Package_DFN_QFN

6.15 × 5.15 × 1.09 mm, measured from the model's own geometry.

3D model

STEP

6.15 × 5.15 × 1.09 mm

241 KB STEP

Format: STEP
Size: 241 KB
Stored as: STEP, zstd-compressed

Footprints that name it

PQFN-8-EP_6x5mm_P1.27mm_GenericPackage_DFN_QFN

Land patterns

Footprints this model sits on

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

Provenance

Source: kicad-packages3d
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception