Footprints
11 footprints matching “12”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD
Package_BGA
121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)
- Pads
- 121
- SMD
- 11.0×11.0
- Boards
- 9
BGA-144_13.0x13.0mm_Layout12x12_P1.0mm
Package_BGA
BGA-144, http://www.topline.tv/drawings/pdf/BGA%201,0mm%20pitch/LBGA144T1.0-DC128.pdf
- Pads
- 144
- SMD
- 15.0×15.0
- Boards
- 1
LFBGA-144_10x10mm_Layout12x12_P0.8mm
Package_BGA
LFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103ze.pdf#page=114
- Pads
- 144
- SMD
- 12.0×12.0
- Boards
- 1
Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 12
- SMD
- 3.4×3.9
- Boards
- 1
TFBGA-121_10x10mm_Layout11x11_P0.8mm
Package_BGA
TFBGA-121, 10.0x10.0mm, 121 Ball, 11x11 Layout, 0.8mm Pitch, http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495
- Pads
- 121
- SMD
- 12.0×12.0
- Boards
- 1
BGA-1295_37.5x37.5mm_Layout36x36_P1.0mm
Package_BGA
BGA-1295
- Pads
- 1295
- SMD
- 39.5×39.5
- Boards
- —
Maxim_WLP-12
Package_BGA
Maxim_WLP-12 W121B2+1 http://pdfserv.maximintegrated.com/package_dwgs/21-0009.PDF
- Pads
- 12
- SMD
- 4.0×3.6
- Boards
- —
Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf
- Pads
- 12
- SMD
- 4.1×3.6
- Boards
- —
Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf
- Pads
- 113
- SMD
- 9.0×9.0
- Boards
- —
Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 12
- SMD
- 4.5×4.0
- Boards
- —
TFBGA-644_19x19mm_Layout28x28_P0.65mm
Package_BGA
TFBGA-636, 19.0x19.0mm, 644 Ball, 28x28 Layout, 0.65mm Pitch, https://opensource.rock-chips.com/images/b/b6/Rockchip_RK3568_Datasheet_V1.3-20220929P.PDF
- Pads
- 644
- SMD
- 21.0×21.0
- Boards
- —