Footprints

46 footprints matching “0.5A”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

46 footprints · page 1 of 2

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Texas_DSBGA-9_1.62x1.58mm_Layout3x3_P0.5mm

FP—

Package_BGA

Texas Instruments, DSBGA, 1.62mmx1.58mm, area grid, NSMD, YZF0009 pad definition, 1.62x1.58mm, 9 Ball, 3x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ml/mxbg027n/mxbg027n.pdf

Pads: 9
SMD: 3.6×3.6
Boards: 4

Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf

Pads: 12
SMD: 3.4×3.9
Boards: 1

UFBGA-64_5x5mm_Layout8x8_P0.5mm

FP—

Package_BGA

UFBGA-64, 5.0x5.0mm, 64 Ball, 8x8 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f051t8.pdf#page=91

Pads: 64
SMD: 7.0×7.0
Boards: 1

Xilinx_CPG236

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 10x10mm, 238 Ball, 19x19 Layout, 0.5mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266

Pads: 238
SMD: 12.0×12.0
Boards: 1

Xilinx_CPG238

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 10x10mm, 238 Ball, 19x19 Layout, 0.5mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267

Pads: 238
SMD: 12.0×12.0
Boards: 1

csBGA-64_5x5mm_Layout8x8_P0.5mm

FP3D

Package_BGA

csBGA-64, 5x5mm, 64 Ball, 8x8 Layout, 0.5mm Pitch, https://www.latticesemi.com/view_document?document_id=213

Pads: 64
SMD: 7.0×7.0
Boards: —

Lattice_iCE40_csBGA-132_8x8mm_Layout14x14_P0.5mm

FP—

Package_BGA

Lattice csBGA-132, Option 2, iCE40 FPGAs, 8.0x8.0mm, 132 Ball, 14x14 Layout, 0.5mm Pitch, http://www.latticesemi.com/view_document?document_id=213

Pads: 132
SMD: 10.0×10.0
Boards: —

LFBGA-153_11.5x13mm_Layout14x14_P0.5mm

FP—

Package_BGA

JEDEC eMMC AN BGA-153, 11.5x13.0mm, 153 Ball, 14x14 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads: 153
SMD: 13.5×15.0
Boards: —

LFBGA-169_12x16mm_Layout14x28_P0.5mm

FP—

Package_BGA

JEDEC eMMC AA BGA-169, 12.0x16.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads: 169
SMD: 14.0×18.0
Boards: —

LFBGA-169_12x18mm_Layout14x28_P0.5mm

FP—

Package_BGA

JEDEC eMMC AB BGA-169, 12.0x18.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads: 169
SMD: 14.0×20.0
Boards: —

LFBGA-169_14x18mm_Layout14x28_P0.5mm

FP—

Package_BGA

JEDEC eMMC AC BGA-169, 14.0x18.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads: 169
SMD: 16.0×20.0
Boards: —

MAPBGA-272_9x9mm_Layout17x17_P0.5mm

FP—

Package_BGA

MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1

Pads: 272
SMD: 11.0×11.0
Boards: —

Microchip_FCSG325_BGA-325_11x11mm_Layout21x21_P0.5mm

FP—

Package_BGA

FCSG325, 11.0x11.0mm, 325 Ball, 21x21 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 325
SMD: 13.0×13.0
Boards: —

Microchip_FCSG536_BGA-536_16x16mm_Layout30x30_P0.5mm

FP—

Package_BGA

FCSG536, 16.0x16.0mm, 536 Ball, 30x30 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 536
SMD: 18.0×18.0
Boards: —