Footprints

30 footprints matching “12”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

30 footprints · page 1 of 2

Matched by name and keywords. Search by meaning instead

BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD

FP3D

Package_BGA

121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)

Pads: 121
SMD: 11.0×11.0
Boards: 9

BGA-144_13.0x13.0mm_Layout12x12_P1.0mm

FP3D

Package_BGA

BGA-144, http://www.topline.tv/drawings/pdf/BGA%201,0mm%20pitch/LBGA144T1.0-DC128.pdf

Pads: 144
SMD: 15.0×15.0
Boards: 1

LFBGA-144_10x10mm_Layout12x12_P0.8mm

FP3D

Package_BGA

LFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103ze.pdf#page=114

Pads: 144
SMD: 12.0×12.0
Boards: 1

Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf

Pads: 12
SMD: 3.4×3.9
Boards: 1

TFBGA-121_10x10mm_Layout11x11_P0.8mm

FP3D

Package_BGA

TFBGA-121, 10.0x10.0mm, 121 Ball, 11x11 Layout, 0.8mm Pitch, http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495

Pads: 121
SMD: 12.0×12.0
Boards: 1

UFBGA-144_10x10mm_Layout12x12_P0.8mm

FP—

Package_BGA

UFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f446ze.pdf#page=189

Pads: 144
SMD: 12.0×12.0
Boards: 1

BGA-100_12x18mm_Layout10x17_P1mm

FP—

Package_BGA

BGA-100, 12x18mm, 100 Ball, 10x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 100
SMD: 14.0×20.0
Boards: —

BGA-1295_37.5x37.5mm_Layout36x36_P1.0mm

FP3D

Package_BGA

BGA-1295

Pads: 1295
SMD: 39.5×39.5
Boards: —

BGA-132_12x18mm_Layout11x17_P1.0mm

FP—

Package_BGA

BGA-132 11x17 12x18mm 1.0pitch

Pads: 132
SMD: 13.0×19.0
Boards: —

BGA-132_12x18mm_Layout11x17_P1mm

FP—

Package_BGA

BGA-132, 12x18mm, 132 Ball, 11x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 132
SMD: 14.0×20.0
Boards: —

BGA-200_10x14.5mm_Layout12x22_P0.8x0.65mm

FP—

Package_BGA

BGA-200, 10.0x14.5mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf

Pads: 200
SMD: 12.0×16.5
Boards: —

BGA-63_9x11mm_Layout10x12_P0.8mm

FP—

Package_BGA

BGA-63, 9.0x11.0mm, 63 Ball, 10x12 Layout, 0.8mm Pitch, https://www.jedec.org/system/files/docs/MO-207N.pdf

Pads: 63
SMD: 11.0×13.0
Boards: —

LFBGA-169_12x16mm_Layout14x28_P0.5mm

FP—

Package_BGA

JEDEC eMMC AA BGA-169, 12.0x16.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads: 169
SMD: 14.0×18.0
Boards: —

LFBGA-169_12x18mm_Layout14x28_P0.5mm

FP—

Package_BGA

JEDEC eMMC AB BGA-169, 12.0x18.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads: 169
SMD: 14.0×20.0
Boards: —

Linear_BGA-133_15.0x15.0mm_Layout12x12_P1.27mm

FP—

Package_BGA

Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf

Pads: 134
SMD: 17.0×17.0
Boards: —

Maxim_WLP-12

FP3D

Package_BGA

Maxim_WLP-12 W121B2+1 http://pdfserv.maximintegrated.com/package_dwgs/21-0009.PDF

Pads: 12
SMD: 4.0×3.6
Boards: —

Maxim_WLP-12_2.008x1.608mm_Layout4x3_P0.4mm

FP—

Package_BGA

Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF

Pads: 12
SMD: 4.0×3.6
Boards: —

ST_TFBGA-361_12x12mm_Layout23x23_P0.5mmP0.65mm

FP—

Package_BGA

ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf

Pads: 361
SMD: 14.0×14.0
Boards: —

ST_UFBGA-121_6x6mm_Layout11x11_P0.5mm

FP—

Package_BGA

ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf

Pads: 121
SMD: 8.0×8.0
Boards: —

ST_UFBGA-129_7x7mm_Layout13x13_P0.5mm

FP—

Package_BGA

ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf

Pads: 129
SMD: 9.0×9.0
Boards: —

Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf

Pads: 12
SMD: 4.1×3.6
Boards: —

Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf

Pads: 113
SMD: 9.0×9.0
Boards: —

Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)

Pads: 12
SMD: 4.5×4.0
Boards: —

TFBGA-324_12x12mm_Layout18x18_P0.65mm

FP—

Package_BGA

TFBGA-324, NSMD, 12.0x12.0mm, 324 Ball, 18x18 Layout, 0.65mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf

Pads: 324
SMD: 14.0×14.0
Boards: —