Footprints
27 footprints matching “15”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Texas_DSBGA-9_1.4715x1.4715mm_Layout3x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 9
- SMD
- 3.5×3.5
- Boards
- 3
UFBGA-201_10x10mm_Layout15x15_P0.65mm
Package_BGA
UFBGA-201, 10.0x10.0mm, 201 Ball, 15x15 Layout, 0.65mm Pitch, http://www.st.com/resource/en/datasheet/stm32f207vg.pdf#page=166
- Pads
- 201
- SMD
- 12.0×12.0
- Boards
- 3
BGA-324_15.0x15.0mm_Layout18x18_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00474-02.pdf
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- 2
Maxim_WLP-9_1.595x1.415_Layout3x3_P0.4mm_Ball0.27mm_Pad0.25mm_NSMD
Package_BGA
Maxim_WLP-9 W91C1+1 https://pdfserv.maximintegrated.com/package_dwgs/21-0459.PDF
- Pads
- 9
- SMD
- 3.6×3.4
- Boards
- 2
TFBGA-216_13x13mm_Layout15x15_P0.8mm
Package_BGA
TFBGA-216, 13.0x13.0mm, 216 Ball, 15x15 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=219
- Pads
- 216
- SMD
- 15.0×15.0
- Boards
- 1
UFBGA-15_3.0x3.0mm_Layout4x4_P0.65mm
Package_BGA
UFBGA-15, 4x4, 3x3mm package, pitch 0.65mm
- Pads
- 15
- SMD
- 5.0×5.0
- Boards
- 1
Analog_BGA-165_11.9x16mm_Layout11x15_P1.0mm
Package_BGA
Analog BGA-165 (Reference LTC DWG#05-08-1605 Rev B), 11.9x16.0mm, 165 Ball, 11x15 Layout, 1.0mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081605_b_bga165.pdf
- Pads
- 165
- SMD
- 13.9×18.0
- Boards
- —
Analog_BGA-77_9x15mm_Layout7x11_P1.27mm
Package_BGA
Analog Devices BGA-77, 0.63mm pad, 9x15mm, 77 Ball, 7x11 Layout, 1.27mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081964_B_bga77.pdf
- Pads
- 77
- SMD
- 11.0×17.0
- Boards
- —
BGA-1156_35.0x35.0mm_Layout34x34_P1.0mm
Package_BGA
BGA-1156
- Pads
- 1156
- SMD
- 37.0×37.0
- Boards
- —
BGA-152_14x18mm_Layout13x17_P0.5mm
Package_BGA
BGA-152_14x18mm_Layout13x17_P0.5mm
- Pads
- 152
- SMD
- 16.0×20.0
- Boards
- —
BGA-152_14x18mm_Layout13x17_P1mm
Package_BGA
BGA-152, 14x18mm, 152 Ball, 13x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf
- Pads
- 152
- SMD
- 16.0×20.0
- Boards
- —
BGA-153_8.0x8.0mm_Layout15x15_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-153, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00471-00.pdf
- Pads
- 153
- SMD
- 10.0×10.0
- Boards
- —
BGA-196_15x15mm_Layout14x14_P1.0mm
Package_BGA
BGA-196, 15.0x15.0mm, 196 Ball, 14x14 Layout, 1.0mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/VMDS-10502.pdf#page=99
- Pads
- 196
- SMD
- 17.0×17.0
- Boards
- —
BGA-324_15x15mm_Layout18x18_P0.8mm
Package_BGA
BGA-324, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://colognechip.com/docs/ds1001-gatemate1-datasheet-2022-05.pdf#page=92
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- —
BGA-90_8.0x13.0mm_Layout2x3x15_P0.8mm
Package_BGA
BGA-90, http://www.issi.com/WW/pdf/42-45S32800J.pdf
- Pads
- 90
- SMD
- 10.0×15.0
- Boards
- —
Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm
Package_BGA
WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf
- Pads
- 8
- SMD
- 4.3×5.1
- Boards
- —
LFBGA-153_11.5x13mm_Layout14x14_P0.5mm
Package_BGA
JEDEC eMMC AN BGA-153, 11.5x13.0mm, 153 Ball, 14x14 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf
- Pads
- 153
- SMD
- 13.5×15.0
- Boards
- —
Linear_BGA-133_15.0x15.0mm_Layout12x12_P1.27mm
Package_BGA
Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf
- Pads
- 134
- SMD
- 17.0×17.0
- Boards
- —
Microchip_FCG1152_BGA-1152_35x35mm_Layout34x34_P1.0mm
Package_BGA
FCG1152, 35.0x35.0mm, 1152 Ball, 34x34 Layout, 1.0mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
- Pads
- 1152
- SMD
- 37.0×37.0
- Boards
- —
ST_TFBGA-225_13x13mm_Layout15x15_P0.8mm
Package_BGA
ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf
- Pads
- 225
- SMD
- 15.0×15.0
- Boards
- —
Texas_BGA-289_15x15mm_Layout17x17_P0.8mm
Package_BGA
Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf
- Pads
- 289
- SMD
- 17.0×17.0
- Boards
- —
Texas_DSBGA-64_3.415x3.535mm_Layout8x8_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, 3.415x3.535mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 64
- SMD
- 5.4×5.5
- Boards
- —
TFBGA-225_10x10mm_Layout15x15_P0.65mm
Package_BGA
TFBGA-225, NSMD, 10.0x10.0mm, 225 Ball, 15x15 Layout, 0.65mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf
- Pads
- 225
- SMD
- 12.0×12.0
- Boards
- —
Xilinx_FFG1156
Package_BGA
Artix-7, Kintex-7 and Zynq-7000 BGA, NSMD pad definition Appendix A, 35x35mm, 1156 Ball, 34x34 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91
- Pads
- 1156
- SMD
- 37.0×37.0
- Boards
- —