Footprints
16 footprints matching “36”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 12
- SMD
- 3.4×3.9
- Boards
- 1
Xilinx_CPG236
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 10x10mm, 238 Ball, 19x19 Layout, 0.5mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266
- Pads
- 238
- SMD
- 12.0×12.0
- Boards
- 1
Alliance_TFBGA-36_6x8mm_Layout6x8_P0.75mm
Package_BGA
Alliance TFBGA-36, NSMD, 6.0x8.0mm, 36 Ball, 6x8 Layout, 0.75mm Pitch, https://www.alliancememory.com/wp-content/uploads/pdf/AS6C1008_Mar_2023V1.2.pdf#page=13
- Pads
- 36
- SMD
- 8.0×10.0
- Boards
- —
BGA-1295_37.5x37.5mm_Layout36x36_P1.0mm
Package_BGA
BGA-1295
- Pads
- 1295
- SMD
- 39.5×39.5
- Boards
- —
BGA-36_3.396x3.466mm_Layout6x6_P0.4mm_Ball0.25mm_Pad0.2mm_NSMD
Package_BGA
Altera V36, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00486-00.pdf
- Pads
- 36
- SMD
- 3.9×4.0
- Boards
- —
Microchip_FCSG536_BGA-536_16x16mm_Layout30x30_P0.5mm
Package_BGA
FCSG536, 16.0x16.0mm, 536 Ball, 30x30 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
- Pads
- 536
- SMD
- 18.0×18.0
- Boards
- —
ST_TFBGA-361_12x12mm_Layout23x23_P0.5mmP0.65mm
Package_BGA
ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf
- Pads
- 361
- SMD
- 14.0×14.0
- Boards
- —
ST_TFBGA-436_18x18mm_Layout22x22_P0.8mm
Package_BGA
ST TFBGA-436, 18.0x18.0mm, 436 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp255c.pdf#page=222
- Pads
- 436
- SMD
- 20.0×20.0
- Boards
- —
ST_uTFBGA-36_3.6x3.6mm_Layout6x6_P0.5mm
Package_BGA
ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf
- Pads
- 36
- SMD
- 5.6×5.6
- Boards
- —
ST_VFBGA-361_10x10mm_Layout19x19_P0.5mm
Package_BGA
ST VFBGA-361, 10.0x10.0mm, 361 Ball, 19x19 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp255c.pdf#page=218
- Pads
- 361
- SMD
- 12.0×12.0
- Boards
- —
Texas_DSBGA-10_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf
- Pads
- 10
- SMD
- 3.4×3.9
- Boards
- —
Texas_DSBGA-5_1.5855x1.6365mm_Layout3x2_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YTA0005 pad definition, 1.5855x1.6365mm, 5 Ball, 3x2 Layout, 0.5mm Pitch, https://www.ti.com/lit/ml/mxbg263/mxbg263.pdf, https://www.ti.com/lit/ds/symlink/lm74.pdf#page=24
- Pads
- 5
- SMD
- 3.6×3.6
- Boards
- —
TFBGA-361_13x13mm_Layout19x19_P0.65mm
Package_BGA
TFBGA-361, NSMD, 13.0x13.0mm, 361 Ball, 19x19 Layout, 0.65mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf
- Pads
- 361
- SMD
- 15.0×15.0
- Boards
- —
TFBGA-644_19x19mm_Layout28x28_P0.65mm
Package_BGA
TFBGA-636, 19.0x19.0mm, 644 Ball, 28x28 Layout, 0.65mm Pitch, https://opensource.rock-chips.com/images/b/b6/Rockchip_RK3568_Datasheet_V1.3-20220929P.PDF
- Pads
- 644
- SMD
- 21.0×21.0
- Boards
- —
UCBGA-36_2.5x2.5mm_Layout6x6_P0.4mm
Package_BGA
UCBGA-36, 2.5x2.5mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.latticesemi.com/view_document?document_id=213
- Pads
- 36
- SMD
- 4.5×4.5
- Boards
- —
XFBGA-36_3.5x3.5mm_Layout6x6_P0.5mm
Package_BGA
XFBGA-36, https://www.nxp.com/docs/en/package-information/SOT1555-1.pdf
- Pads
- 36
- SMD
- 5.7×5.7
- Boards
- —
