Footprints

9 footprints matching “J”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

9 footprints

Matched by name and keywords. Search by meaning instead

BGA-100_12x18mm_Layout10x17_P1mm

FP—

Package_BGA

BGA-100, 12x18mm, 100 Ball, 10x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 100
SMD: 14.0×20.0
Boards: —

BGA-100_14x18mm_Layout10x17_P1mm

FP—

Package_BGA

BGA-100, 14x18mm, 100 Ball, 10x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 100
SMD: 16.0×20.0
Boards: —

BGA-132_12x18mm_Layout11x17_P1mm

FP—

Package_BGA

BGA-132, 12x18mm, 132 Ball, 11x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 132
SMD: 14.0×20.0
Boards: —

BGA-152_14x18mm_Layout13x17_P1mm

FP—

Package_BGA

BGA-152, 14x18mm, 152 Ball, 13x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 152
SMD: 16.0×20.0
Boards: —

BGA-63_9x11mm_Layout10x12_P0.8mm

FP—

Package_BGA

BGA-63, 9.0x11.0mm, 63 Ball, 10x12 Layout, 0.8mm Pitch, https://www.jedec.org/system/files/docs/MO-207N.pdf

Pads: 63
SMD: 11.0×13.0
Boards: —

Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm

FP3D

Package_BGA

WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf

Pads: 8
SMD: 4.3×5.1
Boards: —

Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf

Pads: 113
SMD: 9.0×9.0
Boards: —

Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)

Pads: 12
SMD: 4.5×4.0
Boards: —

Texas_MicroStar_Junior_BGA-80_5.0x5.0mm_Layout9x9_P0.5mm

FP3D

Package_BGA

Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)

Pads: 80
SMD: 6.0×6.0
Boards: —