Footprints
16 footprints matching “Pitch”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DiodesInc_GEA20_WLCSP-20_1.7x2.1mm_Layout4x5_P0.4mm
Package_CSP
Diodes Incorporated WLCSP-20, GEA20, 1.7x2.1mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.diodes.com/assets/Package-Files/GEA20.pdf
- Pads
- 20
- SMD
- 3.7×4.1
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger
Package_CSP
ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101
- Pads
- 19
- SMD
- 3.7×4.5
- Boards
- —
ST_WLCSP-20_1.94x2.4mm_Layout4x5_P0.4mm
Package_CSP
ST WLCSP-20, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=105
- Pads
- 20
- SMD
- 3.9×4.4
- Boards
- —
ST_WLCSP-25_2.33x2.24mm_Layout5x5_P0.4mm
Package_CSP
ST WLCSP-25, ST Die ID 474, 2.33x2.24mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h503eb.pdf#page=155
- Pads
- 25
- SMD
- 4.3×4.2
- Boards
- —
ST_WLCSP-25_Die425
Package_CSP
WLCSP-25, 2.097x2.493mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l031f6.pdf#page=112
- Pads
- 25
- SMD
- 4.1×4.5
- Boards
- —
ST_WLCSP-25_Die444
Package_CSP
WLCSP-25, 2.423x2.325mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f031k6.pdf#page=93
- Pads
- 25
- SMD
- 4.4×4.3
- Boards
- —
ST_WLCSP-25_Die457
Package_CSP
WLCSP-25, 2.133x2.07mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l011k3.pdf#page=100
- Pads
- 25
- SMD
- 4.1×4.1
- Boards
- —
ST_WLCSP-27_2.34x2.55mm_Layout9x6_P0.4mm_Stagger
Package_CSP
ST WLCSP-27, ST Die ID 459, 2.34x2.55mm, 27 Ball, X-staggered 9x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u031g6.pdf#page=105
- Pads
- 27
- SMD
- 4.3×4.6
- Boards
- —
ST_WLCSP-36_Die440
Package_CSP
WLCSP-36, 2.605x2.703mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f051t8.pdf#page=103
- Pads
- 36
- SMD
- 4.6×4.7
- Boards
- —
ST_WLCSP-36_Die458
Package_CSP
WLCSP-36, 2.553x2.579mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f410t8.pdf#page=130
- Pads
- 36
- SMD
- 4.6×4.6
- Boards
- —
ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger
Package_CSP
ST WLCSP-39, ST Die ID 478, 2.76x2.78mm, 39 Ball, X-staggered 11x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h523he.pdf#page=197
- Pads
- 39
- SMD
- 4.8×4.8
- Boards
- —
WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm
Package_CSP
ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23
- Pads
- 6
- SMD
- 3.5×3.1
- Boards
- —
WLCSP-9_1.21x1.22mm_Layout3x3_P0.4mm
Package_CSP
WLCSP-9, 1.21x1.22mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/wlcspcb/cb_9_3.pdf
- Pads
- 9
- SMD
- 3.2×3.2
- Boards
- —
Xilinx_CSG48_7.0x7.0mm_Layout7x7_P0.8mm
Package_CSP
XC9572XL CS BGA, 7x7mm, 48 Ball, 7x7 Layout, 0.8mm Pitch, https://www.xilinx.com/content/dam/xilinx/support/documents/package_specs/cs48.pdf
- Pads
- 48
- SMD
- 9.0×9.0
- Boards
- —