Footprints
83 footprints matching “0.4”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WLCSP-12_1.56x1.56mm_P0.4mm
Package_CSP
WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf
- Pads
- 12
- SMD
- 2.1×2.1
- Boards
- 9
WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm
Package_CSP
WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf
- Pads
- 20
- SMD
- 3.9×4.4
- Boards
- 3
WLCSP-6_1.4x1.0mm_P0.4mm
Package_CSP
6pin Pitch 0.4mm
- Pads
- 6
- SMD
- 1.9×1.5
- Boards
- 2
ST_WLCSP-49_Die447
Package_CSP
WLCSP-49, 3.294x3.258mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l072kz.pdf#page=134
- Pads
- 49
- SMD
- 5.3×5.3
- Boards
- 1
Analog_LFCSP-UQ-10_1.3x1.6mm_P0.4mm
Package_CSP
Analog LFCSP-UQ, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf)
- Pads
- 10
- SMD
- 2.5×2.8
- Boards
- —
Anpec_WLCSP-20_1.76x2.03mm_Layout4x5_P0.4mm
Package_CSP
WLCSP-20, 1.76x2.03mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.lcsc.com/datasheet/lcsc_datasheet_2007032014_Anpec-Elec-APW7261HAI-TRG_C691404.pdf
- Pads
- 20
- SMD
- 3.8×4.0
- Boards
- —
DiodesInc_GEA20_WLCSP-20_1.7x2.1mm_Layout4x5_P0.4mm
Package_CSP
Diodes Incorporated WLCSP-20, GEA20, 1.7x2.1mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.diodes.com/assets/Package-Files/GEA20.pdf
- Pads
- 20
- SMD
- 3.7×4.1
- Boards
- —
Efinix_WLCSP-64_3.5353x3.3753mm_Layout8x8_P0.4mm
Package_CSP
Efinix WLCSP, NSMD pad definition Page 60, 3.5353x3.3753mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf#page=9
- Pads
- 64
- SMD
- 5.5×5.4
- Boards
- —
Efinix_WLCSP-80_4.4567x3.5569mm_Layout10x8_P0.4mm
Package_CSP
WLCSP-80, NSMD pad definition Page 54, 4.4567x3.5569mm, 80 Ball, 10x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf
- Pads
- 80
- SMD
- 6.5×5.6
- Boards
- —
Maxim_WLCSP-35_2.998x2.168mm_Layout7x5_P0.4mm
Package_CSP
WLCSP-35, 2.998x2.168mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF
- Pads
- 35
- SMD
- 5.0×4.2
- Boards
- —
Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Package_CSP
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
- Pads
- 15
- SMD
- 4.4×3.2
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
pSemi_CSP-16_1.64x2.04mm_P0.4mm
Package_CSP
pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf)
- Pads
- 16
- SMD
- 2.1×2.5
- Boards
- —
pSemi_CSP-16_1.64x2.04mm_P0.4mm_Pad0.18mm
Package_CSP
pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf)
- Pads
- 16
- SMD
- 2.1×2.5
- Boards
- —
ST_WLCSP-100_4.437x4.456mm_Layout10x10_P0.4mm
Package_CSP
ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf
- Pads
- 100
- SMD
- 6.4×6.5
- Boards
- —
ST_WLCSP-100_4.4x4.38mm_Layout10x10_P0.4mm_Offcenter
Package_CSP
ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf
- Pads
- 100
- SMD
- 6.4×6.4
- Boards
- —
ST_WLCSP-100_Die422
Package_CSP
WLCSP-100, 4.201x4.663mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f302vc.pdf#page=133
- Pads
- 100
- SMD
- 6.2×6.7
- Boards
- —
ST_WLCSP-100_Die446
Package_CSP
WLCSP-100, 4.775x5.041mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f303zd.pdf#page=162
- Pads
- 100
- SMD
- 6.8×7.1
- Boards
- —
ST_WLCSP-100_Die452
Package_CSP
WLCSP-100, 4.201x4.663mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/DM00330506.pdf#page=218
- Pads
- 100
- SMD
- 6.2×6.7
- Boards
- —
ST_WLCSP-100_Die461
Package_CSP
WLCSP-100, 4.618x4.142mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/DM00284211.pdf#page=259
- Pads
- 100
- SMD
- 6.6×6.2
- Boards
- —
ST_WLCSP-104_Die437
Package_CSP
WLCSP-104, 4.095x5.094mm, 104 Ball, 9x12 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l152ze.pdf#page=127
- Pads
- 104
- SMD
- 6.1×7.1
- Boards
- —
ST_WLCSP-115_4.63x4.15mm_Layout21x11_P0.4mm_Stagger
Package_CSP
ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf
- Pads
- 115
- SMD
- 6.6×6.2
- Boards
- —
ST_WLCSP-143_Die419
Package_CSP
WLCSP-143, 4.521x5.547mm, 143 Ball, 11x13 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f429ng.pdf#page=203
- Pads
- 143
- SMD
- 6.5×7.6
- Boards
- —
ST_WLCSP-143_Die449
Package_CSP
WLCSP-143, 4.539x5.849mm, 143 Ball, 11x13 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=202
- Pads
- 143
- SMD
- 6.5×7.9
- Boards
- —