Footprints
44 footprints matching “G”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm
Package_CSP
WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf
- Pads
- 20
- SMD
- 3.9×4.4
- Boards
- 3
Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.35x2.35mm_ThermalVias
Package_CSP
Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_20.pdf, CP-16-20)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 2
LFCSP-20-1EP_4x4mm_P0.5mm_EP2.1x2.1mm
Package_CSP
LFCSP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_6.pdf)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- 2
Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm
Package_CSP
Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_23.pdf, CP-16-23)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm_ThermalVias
Package_CSP
Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_23.pdf, CP-16-23)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.35x2.35mm
Package_CSP
Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_20.pdf, CP-16-20)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm
Package_CSP
LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)
- Pads
- 5
- SMD
- 4.0×3.5
- Boards
- —
Analog_LFCSP-UQ-10_1.3x1.6mm_P0.4mm
Package_CSP
Analog LFCSP-UQ, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf)
- Pads
- 10
- SMD
- 2.5×2.8
- Boards
- —
Dialog_WLCSP-34_4.54x1.66mm_Layout17x4_P0.25x0.34mm
Package_CSP
Dialog Semiconductor (Renesas) WLCSP-34, staggered array, 4.54x1.66mm, 34 Ball, 17x4 Layout, 0.25x0.34mm Pitch, https://www.renesas.com/us/en/document/dst/da7212-datasheet
- Pads
- 34
- SMD
- 6.5×3.7
- Boards
- —
DiodesInc_GEA20_WLCSP-20_1.7x2.1mm_Layout4x5_P0.4mm
Package_CSP
Diodes Incorporated WLCSP-20, GEA20, 1.7x2.1mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.diodes.com/assets/Package-Files/GEA20.pdf
- Pads
- 20
- SMD
- 3.7×4.1
- Boards
- —
LFCSP-20-1EP_4x4mm_P0.5mm_EP2.1x2.1mm_ThermalVias
Package_CSP
LFCSP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_6.pdf)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm
Package_CSP
LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- —
LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm_ThermalVias
Package_CSP
LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm_ManualAssembly
Package_CSP
OnSemi ODCSP36 (Case 570CP), 0.47mm pad, manual assembly variant (larger pads), 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF
- Pads
- 36
- SMD
- 8.1×8.1
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly
Package_CSP
OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF
- Pads
- 8
- SMD
- 5.2×5.2
- Boards
- —
ST_WLCSP-101_3.86x3.79mm_Layout11x19_P0.35mm_Stagger
Package_CSP
ST WLCSP-101, ST Die ID 485, 3.86x3.79mm, 101 Ball, Y-staggered 11x19 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7r3v8.pdf
- Pads
- 101
- SMD
- 5.9×5.8
- Boards
- —
ST_WLCSP-115_3.73x4.15mm_Layout11x21_P0.35mm_Stagger
Package_CSP
ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf
- Pads
- 115
- SMD
- 5.7×6.2
- Boards
- —
ST_WLCSP-115_4.63x4.15mm_Layout21x11_P0.4mm_Stagger
Package_CSP
ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf
- Pads
- 115
- SMD
- 6.6×6.2
- Boards
- —
ST_WLCSP-12_1.7x1.42mm_Layout4x6_P0.35mm_Stagger
Package_CSP
ST WLCSP-12, ST Die ID 443, 1.7x1.42mm, 12 Ball, Y-staggered 4x6 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c011d6.pdf
- Pads
- 12
- SMD
- 3.7×3.4
- Boards
- —
ST_WLCSP-150_5.38x5.47mm_Layout13x23_P0.4mm_Stagger
Package_CSP
ST WLCSP-150, ST die ID 481, 5.38x5.47mm, 150 Ball, Y-staggered 13x23 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u595zj.pdf
- Pads
- 150
- SMD
- 7.4×7.5
- Boards
- —
ST_WLCSP-18_1.86x2.14mm_Layout7x5_P0.4mm_Stagger
Package_CSP
ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf
- Pads
- 18
- SMD
- 3.9×4.2
- Boards
- —
ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger
Package_CSP
ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101
- Pads
- 19
- SMD
- 3.7×4.5
- Boards
- —