Footprints
18 footprints matching “11”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-18W_7.5x11.6mm_P1.27mm
Package_SO
SOIC, 18 Pin (JEDEC MS-013AB, https://www.analog.com/media/en/package-pcb-resources/package/33254132129439rw_18.pdf)
- Pads
- 18
- SMD
- 11.9×12.1
- Boards
- 163
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
TSOP-I-28_11.8x8mm_P0.55mm
Package_SO
TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)
- Pads
- 28
- SMD
- 14.9×8.7
- Boards
- 6
TSOP-I-32_11.8x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 32
- SMD
- 14.9×8.5
- Boards
- 4
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
TSSOP-44_4.4x11.2mm_P0.5mm
Package_SO
TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)
- Pads
- 44
- SMD
- 7.4×11.9
- Boards
- 2
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
Toshiba_SOIC-4-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 4 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.4pin%20MFSOP6.html)
- Pads
- 4
- SMD
- 8.0×4.1
- Boards
- —
Toshiba_SOIC-5-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 5 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.5pin%20MFSOP6.html)
- Pads
- 5
- SMD
- 8.0×4.1
- Boards
- —
TSSOP-32_6.1x11mm_P0.65mm
Package_SO
TSSOP, 32 Pin (JEDEC MO-153 Var DC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 32
- SMD
- 9.4×11.5
- Boards
- —
TSSOP-32_8x11mm_P0.65mm
Package_SO
TSSOP, 32 Pin (JEDEC MO-153 Var GB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 32
- SMD
- 11.3×11.5
- Boards
- —
TSSOP-40_6.1x11mm_P0.5mm
Package_SO
TSSOP, 40 Pin (JEDEC MO-153 Var EC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 40
- SMD
- 9.4×11.5
- Boards
- —
TSSOP-40_8x11mm_P0.5mm
Package_SO
TSSOP, 40 Pin (JEDEC MO-153 Var HB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 40
- SMD
- 11.3×11.5
- Boards
- —
TSSOP-44_4.4x11mm_P0.5mm
Package_SO
TSSOP, 44 Pin (JEDEC MO-153 Var BE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 44
- SMD
- 7.7×11.5
- Boards
- —
TSSOP-44_6.1x11mm_P0.5mm
Package_SO
TSSOP, 44 Pin (JEDEC MO-153 Var EC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 44
- SMD
- 9.4×11.5
- Boards
- —
TSSOP-52_6.1x11mm_P0.4mm
Package_SO
TSSOP, 52 Pin (JEDEC MO-153 Var FC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 52
- SMD
- 9.4×11.5
- Boards
- —
TSSOP-52_8x11mm_P0.4mm
Package_SO
TSSOP, 52 Pin (JEDEC MO-153 Var JB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 52
- SMD
- 11.3×11.5
- Boards
- —
VSO-56_11.1x21.5mm_P0.75mm
Package_SO
VSO56: plastic very small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf)
- Pads
- 56
- SMD
- 16.6×22.2
- Boards
- —