Footprints

11 footprints matching “32”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

11 footprints

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HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 9

TSOP-II-32_21.0x10.2mm_P1.27mm

FP3D

Package_SO

32-lead plastic TSOP; Type II

Pads: 32
SMD: 13.4×21.0
Boards: 9

TSOP-I-32_11.8x8mm_P0.5mm

FP3D

Package_SO

TSOP-I, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)

Pads: 32
SMD: 14.9×8.5
Boards: 4

TSOP-I-32_12.4x8mm_P0.5mm

FP3D

Package_SO

TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BA)

Pads: 32
SMD: 15.5×8.5
Boards: 4

TSOP-I-32_14.4x8mm_P0.5mm

FP3D

Package_SO

TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BB)

Pads: 32
SMD: 17.5×8.5
Boards: 3

TSOP-I-32_18.4x8mm_P0.5mm

FP3D

Package_SO

TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BD)

Pads: 32
SMD: 21.5×8.5
Boards: 3

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 2