Footprints
22 footprints matching “6mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-18W_7.5x11.6mm_P1.27mm
Package_SO
SOIC, 18 Pin (JEDEC MS-013AB, https://www.analog.com/media/en/package-pcb-resources/package/33254132129439rw_18.pdf)
- Pads
- 18
- SMD
- 11.9×12.1
- Boards
- 163
TSOP-II-54_22.2x10.16mm_P0.8mm
Package_SO
54-lead TSOP typ II package
- Pads
- 54
- SMD
- 13.5×22.7
- Boards
- 55
SO-4_4.4x3.6mm_P2.54mm
Package_SO
4-Lead Plastic Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339
- Pads
- 4
- SMD
- 8.8×4.1
- Boards
- 49
SOP-4_4.4x2.6mm_P1.27mm
Package_SO
SOP, 4 Pin (http://www.vishay.com/docs/83510/tcmt1100.pdf)
- Pads
- 4
- SMD
- 8.5×3.1
- Boards
- 48
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
SOP-28_8.4x18.16mm_P1.27mm
Package_SO
SOP, 28 Pin (https://www.issi.com/WW/pdf/62-65C256AL.pdf#page=12)
- Pads
- 28
- SMD
- 13.9×18.7
- Boards
- 8
SO-4_7.6x3.6mm_P2.54mm
Package_SO
SO, 4 Pin (https://everlightamericas.com/index.php?controller=attachment&id_attachment=3535)
- Pads
- 4
- SMD
- 11.7×4.1
- Boards
- 5
SO-6_4.4x3.6mm_P1.27mm
Package_SO
6-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 6
- SMD
- 8.8×4.1
- Boards
- 4
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 3
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 2
SSO-6_6.8x4.6mm_P1.27mm_Clearance7mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 6
- SMD
- 11.2×5.1
- Boards
- 2
SSO-6_6.8x4.6mm_P1.27mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 6
- SMD
- 13.1×5.1
- Boards
- 1
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- —
SOIC-5-6_4.4x3.6mm_P1.27mm
Package_SO
SOIC, 5 Pin (JEDEC MO-155, variation AA, 2.50mm nominal body thickness, https://www.jedec.org/system/files/docs/Mo-155a.pdf)
- Pads
- 5
- SMD
- 8.4×4.1
- Boards
- —
Toshiba_SOIC-4-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 4 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.4pin%20MFSOP6.html)
- Pads
- 4
- SMD
- 8.0×4.1
- Boards
- —
Toshiba_SOIC-5-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 5 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.5pin%20MFSOP6.html)
- Pads
- 5
- SMD
- 8.0×4.1
- Boards
- —
TSOP-I-24_12.4x6mm_P0.5mm
Package_SO
TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AA)
- Pads
- 24
- SMD
- 15.5×6.5
- Boards
- —
TSOP-I-24_14.4x6mm_P0.5mm
Package_SO
TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AB)
- Pads
- 24
- SMD
- 17.5×6.5
- Boards
- —
TSOP-I-24_16.4x6mm_P0.5mm
Package_SO
TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AC)
- Pads
- 24
- SMD
- 19.5×6.5
- Boards
- —
TSOP-I-24_18.4x6mm_P0.5mm
Package_SO
TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AD)
- Pads
- 24
- SMD
- 21.5×6.5
- Boards
- —