Footprints
18 footprints matching “POWER”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PowerIntegrations_SO-8
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf
- Pads
- 8
- SMD
- 8.0×5.4
- Boards
- 13
PowerIntegrations_SO-8C
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- 3
PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm_ThermalVias
Package_SO
PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)
- Pads
- 17
- SMD
- 7.3×5.4
- Boards
- 1
PowerIntegrations_eSOP-12B
Package_SO
eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 12
- SMD
- 13.6×11.2
- Boards
- —
PowerIntegrations_SO-8B
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- —
PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm
Package_SO
PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)
- Pads
- 17
- SMD
- 7.3×5.4
- Boards
- —
TI_SO-PowerPAD-8
Package_SO
8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)
- Pads
- 9
- SMD
- 8.0×5.4
- Boards
- 33
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
ST_MultiPowerSO-30
Package_SO
MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm (http://www.st.com/resource/en/datasheet/vnh2sp30-e.pdf)
- Pads
- 33
- SMD
- 20.1×17.7
- Boards
- 6
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
ST_PowerSSO-24_SlugDown
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 25
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-24_SlugDown_ThermalVias
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 25
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-24_SlugUp
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 24
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-36_SlugDown
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 37
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-36_SlugDown_ThermalVias
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 37
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-36_SlugUp
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 36
- SMD
- 12.1×10.8
- Boards
- —
Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm
Package_SO
Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 15
- SMD
- 7.8×5.5
- Boards
- —
Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm_ThermalVias
Package_SO
Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 15
- SMD
- 7.8×5.5
- Boards
- —