Footprints

397 footprints

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

397 footprints · page 5 of 17

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf)

Pads
17
SMD
7.0×5.7
Boards
10

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm

FP—

Package_SO

HTSSOP, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20)

Pads
17
SMD
7.8×5.5
Boards
10

JEITA_SOIC-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

JEITA SOIC, 8 Pin (JEITA/EIAJ ED-7311-19, variation 08-001-ADB, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=20)

Pads
8
SMD
7.3×5.4
Boards
10

MSOP-16_3x4.039mm_P0.5mm

FP3D

Package_SO

MSOP, 16 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081669_A_MS16.pdf)

Pads
16
SMD
6.3×4.5
Boards
10

QSOP-24_3.9x8.7mm_P0.635mm

FP3D

Package_SO

QSOP, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)

Pads
24
SMD
7.4×9.2
Boards
10

SO-4_4.4x3.9mm_P2.54mm

FP—

Package_SO

SO, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=10047&prodName=TLP3123)

Pads
4
SMD
8.6×4.4
Boards
10

Diodes_PSOP-8

FP—

Package_SO

8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf)

Pads
9
SMD
7.4×5.4
Boards
9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm

FP—

Package_SO

HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
17
SMD
7.8×5.5
Boards
9

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3mm_ThermalVias

FP—

Package_SO

16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf)

Pads
17
SMD
7.0×5.7
Boards
9

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads
25
SMD
7.8×8.3
Boards
9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads
33
SMD
9.0×11.6
Boards
9

ONSemi_SO-8FL_488AA

FP—

Package_SO

ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF

Pads
5
SMD
7.0×6.1
Boards
9

STC_SOP-16_3.9x9.9mm_P1.27mm

FP—

Package_SO

STC SOP, 16 Pin (https://www.stcmicro.com/datasheet/STC15F2K60S2-en.pdf#page=156)

Pads
16
SMD
7.4×10.4
Boards
9

Texas_R-PDSO-G8_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias

FP—

Package_SO

HSOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf)

Pads
9
SMD
7.4×5.4
Boards
9

TSOP-II-32_21.0x10.2mm_P1.27mm

FP3D

Package_SO

32-lead plastic TSOP; Type II

Pads
32
SMD
13.4×21.0
Boards
9

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads
29
SMD
7.3×10.3
Boards
8

MSOP-10-1EP_3x3mm_P0.5mm_EP1.73x1.98mm

FP—

Package_SO

MSOP, 10 Pin (www.allegromicro.com/~/media/Files/Datasheets/A4952-3-Datasheet.ashx?la=en#page=10)

Pads
11
SMD
6.3×3.5
Boards
8

SOIC-4_4.55x3.7mm_P2.54mm

FP—

Package_SO

SOIC, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=11791&prodName=TLP185)

Pads
4
SMD
8.6×4.2
Boards
8

SOIC-8_5.3x6.2mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (Texas Instruments (based on JEITA/EIAJ 08-001-BBA), 208 mils width, https://www.ti.com/lit/ml/msop001a/msop001a.pdf)

Pads
8
SMD
9.4×6.7
Boards
8

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm

FP—

Package_SO

SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)

Pads
9
SMD
7.4×5.4
Boards
8

SOP-28_8.4x18.16mm_P1.27mm

FP3D

Package_SO

SOP, 28 Pin (https://www.issi.com/WW/pdf/62-65C256AL.pdf#page=12)

Pads
28
SMD
13.9×18.7
Boards
8

SSOP-48_7.5x15.9mm_P0.635mm

FP3D

Package_SO

SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)

Pads
48
SMD
11.1×16.5
Boards
8

TSSOP-38_4.4x9.7mm_P0.5mm

FP3D

Package_SO

TSSOP, 38 Pin (JEDEC MO-153 Var BD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
38
SMD
7.7×10.2
Boards
8

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
21
SMD
7.9×7.1
Boards
7