Footprints

27 footprints matching “15”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

27 footprints · page 1 of 2

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TSSOP-16_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 16
SMD: 7.7×5.5
Boards: 579

SOIC-24W_7.5x15.4mm_P1.27mm

FP3D

Package_SO

SOIC, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf)

Pads: 24
SMD: 11.9×15.9
Boards: 141

SOP-8_6.62x9.15mm_P2.54mm

FP—

Package_SO

SOP, 8 Pin (http://www.ti.com/lit/ds/symlink/iso1050.pdf)

Pads: 8
SMD: 11.9×9.7
Boards: 43

SSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)

Pads: 20
SMD: 7.8×7.0
Boards: 39

SOP-24_7.5x15.4mm_P1.27mm

FP—

Package_SO

SOP, 24 Pin (http://www.issi.com/WW/pdf/31FL3218.pdf#page=14)

Pads: 24
SMD: 11.8×15.9
Boards: 25

SO-24_5.3x15mm_P1.27mm

FP—

Package_SO

SO, 24 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)

Pads: 24
SMD: 9.4×15.5
Boards: 19

SSOP-48_7.5x15.9mm_P0.635mm

FP3D

Package_SO

SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)

Pads: 48
SMD: 11.1×16.5
Boards: 8

MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm

FP3D

Package_SO

MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 7

SOIC-20W_7.5x15.4mm_P1.27mm

FP3D

Package_SO

SOIC, 20 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RI_20_1.pdf)

Pads: 20
SMD: 11.8×15.9
Boards: 4

MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm_ThermalVias

FP3D

Package_SO

MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 3

SOP-18_7.495x11.515mm_P1.27mm

FP—

Package_SO

SOP, 18 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=30523)

Pads: 18
SMD: 11.9×12.0
Boards: 3

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 21
SMD: 15.9×16.6
Boards: 2

SOJ-28_10.16x18.415mm_P1.27mm

FP—

Package_SO

SOJ, 28 Pin (JEDEC MS-027-A, 400 mils width, variation AA, https://www.jedec.org/system/files/docs/Ms-027a.pdf)

Pads: 28
SMD: 12.6×18.9
Boards: 1

TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm

FP—

Package_SO

TSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100132.PDF)

Pads: 21
SMD: 7.8×7.0
Boards: 1

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 21
SMD: 15.9×18.2
Boards: —

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugUp

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 20
SMD: 15.9×16.4
Boards: —

HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 37
SMD: 15.9×18.2
Boards: —

HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 37
SMD: 15.9×16.6
Boards: —

HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp

FP3D

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 36
SMD: 15.9×16.4
Boards: —