Footprints
27 footprints matching “2x”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TSOP-II-54_22.2x10.16mm_P0.8mm
Package_SO
54-lead TSOP typ II package
- Pads
- 54
- SMD
- 13.5×22.7
- Boards
- 55
SOP-8_6.62x9.15mm_P2.54mm
Package_SO
SOP, 8 Pin (http://www.ti.com/lit/ds/symlink/iso1050.pdf)
- Pads
- 8
- SMD
- 11.9×9.7
- Boards
- 43
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm
Package_SO
SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 8
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 7
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm
Package_SO
HTSSOP, 24 Pin (JEDEC MO-153 variation ADT, 1.00mm body thickness, custom Exposed Pad size from STMicroelectronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25, https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=37)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- 4
SO-20-1EP_7.52x12.825mm_P1.27mm_EP6.045x12.09mm_Mask3.56x4.47mm
Package_SO
SO, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf)
- Pads
- 21
- SMD
- 11.9×13.3
- Boards
- 3
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
Texas_DYY0016A_TSOT-23-16_2x4.2mm_P0.5mm
Package_SO
Texas DYY0016A TSSOP, 16 Pin (https://www.ti.com/lit/ds/symlink/tmux1574.pdf#page=42)
- Pads
- 16
- SMD
- 4.6×4.7
- Boards
- 2
HTSSOP-44-1EP_6.1x14mm_P0.635mm_EP5.2x14mm_Mask4.31x8.26mm
Package_SO
HTSSOP, 44 Pin (http://www.ti.com/lit/pdf/pptd165)
- Pads
- 45
- SMD
- 9.5×14.5
- Boards
- 1
HTSSOP-44-1EP_6.1x14mm_P0.635mm_EP5.2x14mm_Mask4.31x8.26mm_ThermalVias
Package_SO
HTSSOP, 44 Pin (http://www.ti.com/lit/pdf/pptd165)
- Pads
- 45
- SMD
- 9.5×14.5
- Boards
- 1
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
MSOP-10-1EP_3x3mm_P0.5mm_EP2.2x3.1mm_Mask1.83x1.89mm
Package_SO
MSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/xtr111.pdf#page=27)
- Pads
- 11
- SMD
- 6.3×3.6
- Boards
- —
MSOP-10-1EP_3x3mm_P0.5mm_EP2.2x3.1mm_Mask1.83x1.89mm_ThermalVias
Package_SO
MSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/xtr111.pdf#page=27)
- Pads
- 11
- SMD
- 6.3×3.6
- Boards
- —
NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm
Package_SO
HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)
- Pads
- 29
- SMD
- 8.0×10.3
- Boards
- —
NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm_ThermalVias
Package_SO
HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)
- Pads
- 29
- SMD
- 8.0×10.3
- Boards
- —
SO-20-1EP_7.52x12.825mm_P1.27mm_EP6.045x12.09mm_Mask3.56x4.47mm_ThermalVias
Package_SO
SO, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf)
- Pads
- 21
- SMD
- 11.9×13.3
- Boards
- —
SOJ-24_7.62x15.875mm_P1.27mm
Package_SO
SOJ, 24 Pin (JEDEC MS-023-A, 300 mils width, variation AA, https://www.jedec.org/system/files/docs/Ms-023a.pdf)
- Pads
- 24
- SMD
- 9.8×16.4
- Boards
- —
SOJ-28_7.62x18.415mm_P1.27mm
Package_SO
SOJ, 28 Pin (JEDEC MS-023-A, 300 mils width, variation AD, https://www.jedec.org/system/files/docs/Ms-023a.pdf)
- Pads
- 28
- SMD
- 9.8×18.9
- Boards
- —
SOJ-32_7.62x20.955mm_P1.27mm
Package_SO
SOJ, 32 Pin (JEDEC MS-023-A, 300 mils width, variation AE, https://www.jedec.org/system/files/docs/Ms-023a.pdf)
- Pads
- 32
- SMD
- 9.8×21.5
- Boards
- —
Texas_DGN0008B_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x3mm_Mask1.88x1.98mm
Package_SO
Texas DGN0008B VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tps7a4101.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —
Texas_DGN0008B_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x3mm_Mask1.88x1.98mm_ThermalVias
Package_SO
Texas DGN0008B VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tps7a4101.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —
Texas_DGN0008D_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x2.94mm_Mask1.57x1.89mm
Package_SO
Texas DGN0008D VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa711.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —