Footprints
226 footprints matching “we”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
D_PowerDI-123
Diode_SMD
http://www.diodes.com/_files/datasheets/ds30497.pdf
- Pads
- 2
- SMD
- 5.0×2.6
- Boards
- 78
L_Bourns_SRN6045TA
Inductor_SMD
http://www.bourns.com/docs/product-datasheets/srn6045ta.pdf
- Pads
- 2
- SMD
- 7.0×6.5
- Boards
- 63
USB_C_Receptacle_GCT_USB4125-xx-x_6P_TopMnt_Horizontal
Connector_USB
USB Type C Receptacle, GCT, power-only, 6P, top mounted, horizontal, 3A, 1mm stake: https://gct.co/files/drawings/usb4125.pdf
- Pads
- 7
- SMD
- 10.7×8.3
- Boards
- 41
TI_SO-PowerPAD-8
Package_SO
8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)
- Pads
- 9
- SMD
- 8.0×5.4
- Boards
- 33
Diodes_PowerDI3333-8
Package_SON
Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf
- Pads
- 5
- SMD
- 4.2×3.8
- Boards
- 33
L_Murata_DFE201610P
Inductor_SMD
Inductor, Murata, DFE201610P, 2.0x1.6x1.0mm, (https://www.murata.com/~/media/webrenewal/products/inductor/chip/tokoproducts/wirewoundmetalalloychiptype/m_dfe201610p.ashx)
- Pads
- 2
- SMD
- 2.5×2.1
- Boards
- 32
USB_C_Receptacle_GCT_USB4135-GF-A_6P_TopMnt_Horizontal
Connector_USB
USB Type C Receptacle, GCT, power-only, 6P, top mounted, horizontal, 3A: https://gct.co/files/drawings/usb4135.pdf
- Pads
- 7
- SMD
- 13.1×8.2
- Boards
- 31
USB_C_Receptacle_GCT_USB4125-xx-x-0190_6P_TopMnt_Horizontal
Connector_USB
USB Type C Receptacle, GCT, power-only, 6P, top mounted, horizontal, 3A, 1.9mm stake: https://gct.co/files/drawings/usb4125.pdf
- Pads
- 7
- SMD
- 10.7×8.3
- Boards
- 30
LFPAK56
Package_TO_SOT_SMD
LFPAK56 https://assets.nexperia.com/documents/outline-drawing/SOT669.pdf
- Pads
- 5
- SMD
- 7.3×5.5
- Boards
- 22
L_Changjiang_FNR4030S
Inductor_SMD
Inductor, Changjiang, FNR4030S, 4.0x4.0x3.0mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)
- Pads
- 2
- SMD
- 4.6×4.5
- Boards
- 15
L_Bourns_SRP5030T
Inductor_SMD
Inductor, Bourns, SRP5030T, 5.7x5.2x2.8mm, (https://www.bourns.com/data/global/pdfs/SRP5030T.pdf)
- Pads
- 2
- SMD
- 7.0×5.7
- Boards
- 13
PowerIntegrations_SO-8
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf
- Pads
- 8
- SMD
- 8.0×5.4
- Boards
- 13
L_Changjiang_FNR4020S
Inductor_SMD
Inductor, Changjiang, FNR4020S, 4.0x4.0x2.0mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)
- Pads
- 2
- SMD
- 4.6×4.5
- Boards
- 10
L_Changjiang_FXL0420
Inductor_SMD
Inductor, Changjiang, FXL0420, 3.85x4.2x1.8mm, (https://www.lcsc.com/datasheet/lcsc_datasheet_2404260921_cjiang--Changjiang-Microelectronics-Tech-FXL0420-2R2-M_C167206.pdf)
- Pads
- 2
- SMD
- 5.7×4.7
- Boards
- 10
L_Wurth_WE-LQSH-4020
Inductor_SMD_Wurth
Semi-Shielded High Saturation Power Inductor, body 4x4mm, https://www.we-online.com/catalog/en/WE-LQSH#/articles/WE-LQSH-4020
- Pads
- 2
- SMD
- 4.8×4.5
- Boards
- 10
L_TDK_SLF7045
Inductor_SMD
Inductor, TDK, SLF7045, 7.0x7.0x4.5mm, (https://product.tdk.com/en/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_power_slf7045_en.pdf)
- Pads
- 2
- SMD
- 8.3×7.5
- Boards
- 9
L_TechFuse_SL0650
Inductor_SMD
Inductor, TechFuse, SL0650, 7.1x6.6x5.0mm, ( http://www.sealand-pptc.com/product_view.php?r=77)
- Pads
- 2
- SMD
- 8.9×7.1
- Boards
- 9
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
L_Changjiang_FNR3015S
Inductor_SMD
Inductor, Changjiang, FNR3015S, 3.0x3.0x1.5mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)
- Pads
- 2
- SMD
- 3.6×3.5
- Boards
- 8
L_Changjiang_FNR5045S
Inductor_SMD
Inductor, Changjiang, FNR5045S, 5.0x5.0x4.5mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)
- Pads
- 2
- SMD
- 5.6×5.5
- Boards
- 8
MonoWireless_TWE-L-WX
RF_Module
https://www.mono-wireless.com/jp/products/TWE-LITE/MW-PDS-TWELITE-JP.pdf
- Pads
- 32
- SMD
- 15.4×15.4
- Boards
- 8
L_Changjiang_FNR5020S
Inductor_SMD
Inductor, Changjiang, FNR5020S, 5.0x5.0x2.0mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)
- Pads
- 2
- SMD
- 5.6×5.5
- Boards
- 7
L_Abracon_ASPI-0425
Inductor_SMD
Inductor, Abracon, ASPI-0425, 4.0x4.0x2.5mm, (https://abracon.com/Magnetics/new/ASPI-0425.pdf)
- Pads
- 2
- SMD
- 5.1×4.5
- Boards
- 6