Footprints

2,978 footprints matching “PITCH,”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

2,978 footprints · page 1 of 125

Matched by name and keywords. Search by meaning instead

PinHeader_2x05_P1.27mm_Vertical_SMD

FP3D

Connector_PinHeader_1.27mm

surface-mounted straight pin header, 2x05, 1.27mm pitch, double rows

Pads: 10
SMD: 8.6×7.4
Boards: 304

InvenSense_QFN-24_4x4mm_P0.5mm

FP—

Sensor_Motion

24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 5.3×5.3
Boards: 136

PinHeader_2x07_P1.27mm_Vertical_SMD

FP3D

Connector_PinHeader_1.27mm

surface-mounted straight pin header, 2x07, 1.27mm pitch, double rows

Pads: 14
SMD: 8.6×9.9
Boards: 130

TI_SO-PowerPAD-8_ThermalVias

FP—

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf

Pads: 9
SMD: 7.5×5.5
Boards: 103

PinHeader_2x03_P2.54mm_Vertical_SMD

FP3D

Connector_PinHeader_2.54mm

surface-mounted straight pin header, 2x03, 2.54mm pitch, double rows

Pads: 6
SMD: 11.7×8.6
Boards: 95

microSD_HC_Molex_104031-0811

FP—

Connector_Card

1.10mm Pitch microSD Memory Card Connector, Surface Mount, Push-Pull Type, 1.42mm Height, with Detect Switch (https://www.molex.com/pdm_docs/sd/1040310811_sd.pdf)

Pads: 11
SMD: 13.7×13.1
Boards: 91

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 87

USON-10_2.5x1.0mm_P0.5mm

FP3D

Package_SON

USON-10 2.5x1.0mm_ Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf

Pads: 10
SMD: 1.8×3.0
Boards: 84

InvenSense_QFN-24_3x3mm_P0.4mm

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 4.1×4.1
Boards: 74

SSOP-8_2.95x2.8mm_P0.65mm

FP3D

Package_SO

SSOP-8 2.9 x2.8mm Pitch 0.65mm

Pads: 8
SMD: 5.5×3.3
Boards: 57

LGA-28_5.2x3.8mm_P0.5mm

FP3D

Package_LGA

LGA 28 5.2x3.8mm Pitch 0.5mm

Pads: 28
SMD: 6.0×4.5
Boards: 56

SSOP-20_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)

Pads: 20
SMD: 6.9×9.3
Boards: 54

PinHeader_2x05_P2.54mm_Vertical_SMD

FP3D

Connector_PinHeader_2.54mm

surface-mounted straight pin header, 2x05, 2.54mm pitch, double rows

Pads: 10
SMD: 11.7×13.7
Boards: 47

Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias

FP3D

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf

Pads: 9
SMD: 8.4×5.5
Boards: 47

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 47

Texas_DRC0010J_ThermalVias

FP—

Package_SON

Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf

Pads: 11
SMD: 3.9×3.9
Boards: 45

PinHeader_1x04_P2.54mm_Vertical_SMD_Pin1Left

FP3D

Connector_PinHeader_2.54mm

surface-mounted straight pin header, 1x04, 2.54mm pitch, single row, style 1 (pin 1 left)

Pads: 4
SMD: 6.8×11.2
Boards: 40

Texas_DRT-3

FP3D

Package_TO_SOT_SMD

Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf

Pads: 3
SMD: 1.6×1.4
Boards: 39

PinHeader_1x03_P2.54mm_Vertical_SMD_Pin1Left

FP3D

Connector_PinHeader_2.54mm

surface-mounted straight pin header, 1x03, 2.54mm pitch, single row, style 1 (pin 1 left)

Pads: 3
SMD: 6.8×8.6
Boards: 38

PinHeader_2x04_P2.54mm_Vertical_SMD

FP3D

Connector_PinHeader_2.54mm

surface-mounted straight pin header, 2x04, 2.54mm pitch, double rows

Pads: 8
SMD: 11.7×11.2
Boards: 36

Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias

FP—

Package_SO

Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)

Pads: 9
SMD: 7.5×5.5
Boards: 34

PinHeader_1x02_P2.54mm_Vertical_SMD_Pin1Left

FP3D

Connector_PinHeader_2.54mm

surface-mounted straight pin header, 1x02, 2.54mm pitch, single row, style 1 (pin 1 left)

Pads: 2
SMD: 6.8×6.1
Boards: 33

SSOP-28_3.9x9.9mm_P0.635mm

FP3D

Package_SO

SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)

Pads: 28
SMD: 6.9×10.4
Boards: 33

microSD_HC_Molex_47219-2001

FP—

Connector_Card

1.10mm Pitch microSD Card Connector, Hinge Type, https://www.molex.com/pdm_docs/sd/472192001_sd.pdf

Pads: 9
SMD: 15.7×15.0
Boards: 30