Footprints

509 footprints matching “Power”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

509 footprints · page 1 of 22

Matched by name and keywords. Search by meaning instead

PowerPAK_SO-8_Single

FP—

Package_SO

PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf)

Pads
5
SMD
7.1×5.5
Boards
41

PowerIntegrations_SO-8

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf

Pads
8
SMD
8.0×5.4
Boards
13

PowerPAK_SO-8_Dual

FP—

Package_SO

PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf)

Pads
6
SMD
7.1×5.5
Boards
6

PowerPAK_SO-8L_Single

FP—

Package_SO

PowerPAK SO-8L Single (https://www.vishay.com/docs/64721/an913.pdf)

Pads
5
SMD
7.8×6.8
Boards
4

PowerIntegrations_SMD-8

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads
8
SMD
11.1×10.7
Boards
3

PowerIntegrations_SO-8C

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf

Pads
7
SMD
7.4×5.4
Boards
3

PowerIntegrations_SMD-8B

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads
7
SMD
11.1×10.7
Boards
2

PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm_ThermalVias

FP3D

Package_SO

PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)

Pads
17
SMD
7.3×5.4
Boards
1

PowerFLAT-5x6

FP—

agg-agg

Pads
6
SMD
5.9×7.1
Boards
—

PowerPair-3x3

FP—

agg-agg

Pads
5
SMD
3.5×3.8
Boards
—

PowerPAK-1212-8

FP—

agg-agg

Pads
3
SMD
4.4×3.8
Boards
—

PowerPAK-SC-75-6L-Single

FP—

agg-agg

Pads
3
SMD
2.1×2.2
Boards
—

PowerPAK-SO-8

FP—

agg-agg

Pads
3
SMD
7.1×5.7
Boards
—

PowerSOIC-8_W3.9mm

FP—

digikey-digikey-footprints

Pads
9
SMD
5.4×8.5
Boards
—

PowerSOIC-8_W3.9mm

FP—

digikey-Source_Footprints

Pads
9
SMD
5.4×8.5
Boards
—

Power_inductor_SMD_0530

FP—

muratovas-MAS_Package_std

Power inductor SMD 0530 (5.4x5.2x3mm)

Pads
2
SMD
6.6×5.6
Boards
—

PowerIntegrations_SMD-8C

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads
7
SMD
11.1×10.7
Boards
—

PowerIntegrations_eSOP-12B

FP3D

Package_SO

eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads
12
SMD
13.6×11.2
Boards
—

PowerIntegrations_SO-8B

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf

Pads
7
SMD
7.4×5.4
Boards
—

PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm

FP3D

Package_SO

PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)

Pads
17
SMD
7.3×5.4
Boards
—

PowerMacro_M234_NoHole

FP—

Package_TO_SOT_SMD

TO-50-4 Power Macro Package Style M234

Pads
4
SMD
24.0×21.0
Boards
—

PowerMacro_M234_WithHole

FP—

Package_TO_SOT_SMD

TO-50-4 Power Macro Package Style M234

Pads
4
SMD
24.0×21.0
Boards
—

HOPERF_RFM9XW_SMD

FP—

RF_Module

Low Power Long Range Transceiver Module SMD-16 (https://www.hoperf.com/data/upload/portal/20181127/5bfcbea20e9ef.pdf)

Pads
16
SMD
18.5×16.5
Boards
105

TI_SO-PowerPAD-8_ThermalVias

FP—

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf

Pads
9
SMD
7.5×5.5
Boards
103