Footprints
354 footprints matching “pads”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 12
- SMD
- 4.5×4.0
- Boards
- —
Texas_MicroStar_Junior_BGA-80_5.0x5.0mm_Layout9x9_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 80
- SMD
- 6.0×6.0
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
DIP-10_W7.62mm_SMDSocket_SmallPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 10
- SMD
- 10.7×13.3
- Boards
- —
DIP-10_W7.62mm_Socket_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 10
- THT
- 10.7×13.3
- Boards
- —
DIP-10_W8.89mm_SMDSocket_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 10
- SMD
- 12.5×13.3
- Boards
- —
DIP-18_W7.62mm_SMDSocket_SmallPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 18
- SMD
- 10.7×23.5
- Boards
- —
DIP-18_W8.89mm_SMDSocket_LongPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 18
- SMD
- 12.5×23.5
- Boards
- —
DIP-20_W7.62mm_SMDSocket_SmallPads
Package_DIP
20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 20
- SMD
- 10.7×26.0
- Boards
- —
DIP-22_W10.16mm_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 22
- THT
- 13.1×28.4
- Boards
- —
DIP-22_W10.16mm_SMDSocket_SmallPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), SMDSocket, SmallPads
- Pads
- 22
- SMD
- 13.2×28.6
- Boards
- —
DIP-22_W10.16mm_Socket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket, LongPads
- Pads
- 22
- THT
- 13.2×28.6
- Boards
- —
DIP-22_W11.43mm_SMDSocket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 11.43mm (450 mils), SMDSocket, LongPads
- Pads
- 22
- SMD
- 15.0×28.6
- Boards
- —
DIP-22_W7.62mm_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 22
- THT
- 10.5×28.4
- Boards
- —
DIP-22_W7.62mm_SMDSocket_SmallPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 22
- SMD
- 10.7×28.6
- Boards
- —
DIP-22_W7.62mm_Socket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 22
- THT
- 10.7×28.6
- Boards
- —
DIP-22_W8.89mm_SMDSocket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 22
- SMD
- 12.5×28.6
- Boards
- —
DIP-24_W10.16mm_SMDSocket_SmallPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), SMDSocket, SmallPads
- Pads
- 24
- SMD
- 13.2×31.1
- Boards
- —
DIP-24_W10.16mm_Socket_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket, LongPads
- Pads
- 24
- THT
- 13.2×31.1
- Boards
- —
DIP-24_W11.43mm_SMDSocket_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 11.43mm (450 mils), SMDSocket, LongPads
- Pads
- 24
- SMD
- 15.0×31.1
- Boards
- —