Footprints
3,408 footprints matching “3”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Oscillator_SeikoEpson_SG-8002DB
Oscillator
14-lead dip package, row spacing 7.62 mm (300 mils)
- Pads
- 4
- THT
- 9.8×20.4
- Boards
- —
BGA-100_6.0x6.0mm_Layout11x11_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-100, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00345-01.pdf
- Pads
- 100
- SMD
- 8.0×8.0
- Boards
- —
BGA-1023_33.0x33.0mm_Layout32x32_P1.0mm
Package_BGA
BGA-1023
- Pads
- 1023
- SMD
- 35.0×35.0
- Boards
- —
BGA-1156_35.0x35.0mm_Layout34x34_P1.0mm
Package_BGA
BGA-1156
- Pads
- 1156
- SMD
- 37.0×37.0
- Boards
- —
BGA-1295_37.5x37.5mm_Layout36x36_P1.0mm
Package_BGA
BGA-1295
- Pads
- 1295
- SMD
- 39.5×39.5
- Boards
- —
BGA-144_7.0x7.0mm_Layout13x13_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-144, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00346-00.pdf
- Pads
- 144
- SMD
- 9.0×9.0
- Boards
- —
BGA-25_6.35x6.35mm_Layout5x5_P1.27mm
Package_BGA
BGA-25, https://www.analog.com/media/en/technical-documentation/data-sheets/ltm4624.pdf
- Pads
- 25
- SMD
- 8.2×8.2
- Boards
- —
BGA-256_11.0x11.0mm_Layout20x20_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-256, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00348-01.pdf
- Pads
- 256
- SMD
- 13.0×13.0
- Boards
- —
BGA-324_19.0x19.0mm_Layout18x18_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
BGA-324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00233-03.pdf
- Pads
- 324
- SMD
- 21.0×21.0
- Boards
- —
BGA-352_35.0x35.0mm_Layout26x26_P1.27mm
Package_BGA
BGA-352, https://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/b352p05.pdf
- Pads
- 352
- SMD
- 37.0×37.0
- Boards
- —
BGA-68_5.0x5.0mm_Layout9x9_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-68, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00344-01.pdf
- Pads
- 68
- SMD
- 7.0×7.0
- Boards
- —
BGA-81_4.496x4.377mm_Layout9x9_P0.4mm_Ball0.25mm_Pad0.2mm_NSMD
Package_BGA
Altera V81, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00478-01.pdf
- Pads
- 81
- SMD
- 6.5×6.4
- Boards
- —
BGA-90_8.0x13.0mm_Layout2x3x15_P0.8mm
Package_BGA
BGA-90, http://www.issi.com/WW/pdf/42-45S32800J.pdf
- Pads
- 90
- SMD
- 10.0×15.0
- Boards
- —
FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
Xilinx FB-484, https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
FBGA-78_7.5x11mm_Layout2x3x13_P0.8mm
Package_BGA
FBGA-78, https://www.skhynix.com/product/filedata/fileDownload.do?seq=7687
- Pads
- 78
- SMD
- 9.5×13.0
- Boards
- —
FCPBGA-780_23x23mm_Layout28x28_P0.8mm
Package_BGA
FCPBGA-780, 23.0x23.0mm, 780 Ball, 28x28 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00854D.pdf
- Pads
- 780
- SMD
- 25.0×25.0
- Boards
- —
Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm
Package_BGA
WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf
- Pads
- 8
- SMD
- 4.3×5.1
- Boards
- —
NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm
Package_BGA
NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf
- Pads
- 98
- SMD
- 9.0×9.0
- Boards
- —
NXP_VFBGA-42_2.6x3mm_Layout6x7_P0.4mm
Package_BGA
NXP VFBGA-42, 2.6x3.0mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf
- Pads
- 42
- SMD
- 4.6×5.0
- Boards
- —
Texas_DSBGA-10_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf
- Pads
- 10
- SMD
- 3.4×3.9
- Boards
- —
Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf
- Pads
- 12
- SMD
- 4.1×3.6
- Boards
- —
Texas_DSBGA-49_3.33x3.488mm_Layout7x7_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, 3.33x3.488mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 49
- SMD
- 5.3×5.5
- Boards
- —
Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm
Package_BGA
Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf
- Pads
- 6
- SMD
- 2.8×3.0
- Boards
- —
Texas_MicroStar_Junior_BGA-113_7x7mm_Layout12x12_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, NSMD, 7x7mm, 113 Ball, 12x12 Layout, 0.5mm Pitch, http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf
- Pads
- 113
- SMD
- 9.0×9.0
- Boards
- —