Footprints

387 footprints matching “1mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

387 footprints · page 15 of 17

Matched by name and keywords. Search by meaning instead

BGA-624_21x21mm_Layout25x25_P0.8mm

FP3D

Package_BGA

BGA-624, 21.0x21.0mm, 624 Ball, 25x25 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf

Pads
624
SMD
23.0×23.0
Boards
—

FBGA-78_7.5x11mm_Layout2x3x13_P0.8mm

FP3D

Package_BGA

FBGA-78, https://www.skhynix.com/product/filedata/fileDownload.do?seq=7687

Pads
78
SMD
9.5×13.0
Boards
—

Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf

Pads
12
SMD
4.1×3.6
Boards
—

Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm

FP3D

Package_BGA

Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf

Pads
6
SMD
2.8×3.0
Boards
—

Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm

FP3D

Package_CSP

Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_23.pdf, CP-16-23)

Pads
17
SMD
5.3×5.3
Boards
—

Analog_LFCSP-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm_ThermalVias

FP3D

Package_CSP

Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp_16_23.pdf, CP-16-23)

Pads
17
SMD
5.3×5.3
Boards
—

DiodesInc_GEA20_WLCSP-20_1.7x2.1mm_Layout4x5_P0.4mm

FP3D

Package_CSP

Diodes Incorporated WLCSP-20, GEA20, 1.7x2.1mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.diodes.com/assets/Package-Files/GEA20.pdf

Pads
20
SMD
3.7×4.1
Boards
—

LFCSP-20-1EP_4x4mm_P0.5mm_EP2.1x2.1mm_ThermalVias

FP3D

Package_CSP

LFCSP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_6.pdf)

Pads
21
SMD
5.3×5.3
Boards
—

WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm

FP3D

Package_CSP

ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23

Pads
6
SMD
3.5×3.1
Boards
—

QFN-64-1EP_9x9mm_P0.5mm_EP4.1x4.1mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 64 Pin (https://www.silabs.com/documents/public/data-sheets/cp2108-datasheet.pdf)

Pads
65
SMD
10.2×10.2
Boards
—

QFN-76-1EP_9x9mm_P0.4mm_EP5.81x6.31mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 76 Pin (https://ftdichip.com/wp-content/uploads/2020/07/DS_FT600Q-FT601Q-IC-Datasheet.pdf#page=27)

Pads
77
SMD
10.3×10.3
Boards
—

Texas_RGY_R-PVQFN-N24_EP2.05x3.1mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40)

Pads
25
SMD
4.8×6.8
Boards
—

Texas_RVE0028A_VQFN-28-1EP_3.5x4.5mm_P0.4mm_EP2.1x3.1mm

FP3D

Package_DFN_QFN

Texas RVE0028A VQFN, 28 Pin (http://www.ti.com/lit/ds/symlink/tps51363.pdf#page=29)

Pads
29
SMD
4.8×5.8
Boards
—

Texas_RVE0028A_VQFN-28-1EP_3.5x4.5mm_P0.4mm_EP2.1x3.1mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RVE0028A VQFN, 28 Pin (http://www.ti.com/lit/ds/symlink/tps51363.pdf#page=29)

Pads
29
SMD
4.8×5.8
Boards
—

TQFN-20-1EP_5x5mm_P0.65mm_EP3.1x3.1mm_ThermalVias

FP3D

Package_DFN_QFN

TQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-3))

Pads
21
SMD
6.2×6.2
Boards
—

TQFN-48-1EP_7x7mm_P0.5mm_EP5.1x5.1mm_ThermalVias

FP3D

Package_DFN_QFN

TQFN, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0144.pdf)

Pads
49
SMD
8.3×8.3
Boards
—

UQFN-12-1EP_2x2mm_P0.4mm_EP1.1x1.1mm

FP3D

Package_DFN_QFN

UQFN, 12 Pin (https://www.wch-ic.com/download/file?id=396, https://www.wch-ic.com/downloads/CH32V006DS0_PDF.html, https://www.wch-ic.com/downloads/PACKAGE_PDF.html)

Pads
13
SMD
3.3×3.3
Boards
—

VQFN-12-1EP_4x4mm_P0.8mm_EP2.1x2.1mm

FP3D

Package_DFN_QFN

VQFN, 12 Pin (https://www.mouser.ch/datasheet/2/268/EMC2301_2_3_5_Data_Sheet_DS20006532A-3443118.pdf)

Pads
13
SMD
5.2×5.2
Boards
—

VQFN-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm

FP3D

Package_DFN_QFN

VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128)

Pads
49
SMD
8.3×8.3
Boards
—

DIP-24_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads
24
SMD
20.1×31.1
Boards
—

DIP-32_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads
32
SMD
20.1×41.3
Boards
—

DIP-40_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads
40
SMD
20.1×51.4
Boards
—

DIP-42_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

42-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads
42
SMD
20.1×54.0
Boards
—

DIP-48_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads
48
SMD
20.1×61.6
Boards
—