Footprints

84 footprints matching “8-pin”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

84 footprints · page 2 of 4

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SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 17

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 14

MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)

Pads: 9
SMD: 6.3×3.5
Boards: 14

DFN-8-1EP_2x3mm_P0.5mm_EP0.61x2.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081702_c_ddb8.pdf)

Pads: 9
SMD: 3.3×3.5
Boards: 13

TerminalBlock_Phoenix_MKDS-1,5-8-5.08_1x08_P5.08mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-8-5.08, 8 pins, pitch 5.08mm, size 40.6x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 8
THT: 41.6×10.8
Boards: 13

TerminalBlock_Phoenix_PT-1,5-8-5.0-H_1x08_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-8-5.0-H, 8 pins, pitch 5mm, size 40x9mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf

Pads: 8
THT: 41.0×10.0
Boards: 12

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 11

TerminalBlock_Phoenix_MPT-0,5-8-2.54_1x08_P2.54mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MPT-0,5-8-2.54, 8 pins, pitch 2.54mm, size 20.8x6.2mm, drill diameter 1.1mm, pad diameter 2.2mm, http://www.mouser.com/ds/2/324/ItemDetail_1725672-916605.pdf

Pads: 8
THT: 21.8×7.2
Boards: 11

JEITA_SOIC-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

JEITA SOIC, 8 Pin (JEITA/EIAJ ED-7311-19, variation 08-001-ADB, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=20)

Pads: 8
SMD: 7.3×5.4
Boards: 10

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9

WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm

FP3D

Package_DFN_QFN

WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)

Pads: 9
SMD: 5.2×3.5
Boards: 8

SOIC-8_5.3x6.2mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (Texas Instruments (based on JEITA/EIAJ 08-001-BBA), 208 mils width, https://www.ti.com/lit/ml/msop001a/msop001a.pdf)

Pads: 8
SMD: 9.4×6.7
Boards: 8

TerminalBlock_Phoenix_MKDS-1,5-8_1x08_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-8, 8 pins, pitch 5mm, size 40x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 8
THT: 41.0×10.8
Boards: 8

TerminalBlock_Phoenix_PT-1,5-8-3.5-H_1x08_P3.50mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-8-3.5-H, 8 pins, pitch 3.5mm, size 28x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,

Pads: 8
THT: 29.0×8.6
Boards: 8

DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/506AQ.PDF)

Pads: 9
SMD: 3.2×2.5
Boards: 7

MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm

FP3D

Package_SO

MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 7

Hirose_FH12-8S-0.5SH_1x08-1MP_P0.50mm_Horizontal

FP3D

Connector_FFC-FPC

Hirose FH12, FFC/FPC connector, FH12-8S-0.5SH, 8 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)

Pads: 9
SMD: 10.1×7.9
Boards: 5

MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm_ThermalVias

FP3D

Package_SO

MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)

Pads: 9
SMD: 6.3×3.5
Boards: 5

Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm

FP3D

Package_DFN_QFN

Micrel MLF, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf)

Pads: 9
SMD: 3.2×2.5
Boards: 4

Analog_LCC-8_5x5mm_P1.27mm

FP3D

Package_LCC

LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf

Pads: 8
SMD: 6.3×6.4
Boards: 4