Footprints
43 footprints matching “AA”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SC-82AA_Handsoldering
Package_TO_SOT_SMD
SC-82AA
- Pads
- 4
- SMD
- 4.4×2.8
- Boards
- 1
DO-214AA-SMB
agg-agg
- Pads
- 2
- SMD
- 7.3×4.5
- Boards
- —
BatteryHolder_MPD_BC12AAPC_2xAA
Battery
2xAA cell battery holder, Memory Protection Devices P/N BC12AAPC, http://www.memoryprotectiondevices.com/datasheets/BC12AAPC-datasheet.pdf
- Pads
- 2
- THT
- 108.8×17.2
- Boards
- —
Heatsink_AAVID_Extruded_531002B02100G_34.9x12.7mm_H25.4mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 25.4mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531002B02500G_34.9x12.7mm_H25.4mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐220, 25.4mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531102B00000G_34.9x12.7mm_H38.1mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 38.1mm height, no pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- —
- Mount
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531102B02100G_34.9x12.7mm_H38.1mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531102B02500G_34.9x12.7mm_H38.1mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531102V02500G_34.9x12.7mm_H38.1mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, AavSHIELD3 finish, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531202B00000G_34.9x12.7mm_H50.8mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, no pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- —
- Mount
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531202B02100G_34.9x12.7mm_H50.8mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531202B02500G_34.9x12.7mm_H50.8mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531302B02500G_34.9x12.7mm_H63.5mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 63.5mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
L_Bourns_SRP2313AA
Inductor_SMD
Bourns SRR1260 series SMD inductor http://www.bourns.com/docs/product-datasheets/srp2313aa.pdf
- Pads
- 2
- SMD
- 24.5×22.5
- Boards
- —
MBS
muratovas-MAS_Package_std
SMD package MBS
- Pads
- 4
- SMD
- 8.9×5.2
- Boards
- —
Microchip_PQFP-44_10x10mm_P0.8mm
Package_QFP
Microchip PQFP, 44 Pin (JEDEC MO-112 variation AA-2, Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20005418B.pdf#page=10, https://www.analog.com/media/en/technical-documentation/data-sheets/ad7722.pdf#page=23)
- Pads
- 44
- SMD
- 15.4×15.4
- Boards
- —
SOIC-5-6_4.4x3.6mm_P1.27mm
Package_SO
SOIC, 5 Pin (JEDEC MO-155, variation AA, 2.50mm nominal body thickness, https://www.jedec.org/system/files/docs/Mo-155a.pdf)
- Pads
- 5
- SMD
- 8.4×4.1
- Boards
- —
TSOP-I-24_12.4x6mm_P0.5mm
Package_SO
TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AA)
- Pads
- 24
- SMD
- 15.5×6.5
- Boards
- —
SC-82AA
Package_TO_SOT_SMD
SC-82AA
- Pads
- 4
- SMD
- 3.0×2.8
- Boards
- —