Footprints
40 footprints matching “board”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Molex_SlimStack_55560-0401_2x20_P0.50mm_Vertical
Connector_Molex
Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0401, 40 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf)
- Pads
- 40
- SMD
- 12.5×5.9
- Boards
- —
Molex_SlimStack_55560-0501_2x25_P0.50mm_Vertical
Connector_Molex
Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0501, 50 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf)
- Pads
- 50
- SMD
- 15.0×5.9
- Boards
- —
Molex_SlimStack_55560-0601_2x30_P0.50mm_Vertical
Connector_Molex
Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0601, 60 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf)
- Pads
- 60
- SMD
- 17.5×5.9
- Boards
- —
Molex_SlimStack_55560-0801_2x40_P0.50mm_Vertical
Connector_Molex
Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0801, 80 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf)
- Pads
- 80
- SMD
- 22.5×5.9
- Boards
- —
TE_440055-2_1x02_P2.00mm_Horizontal
Connector_TE-Connectivity
TE Connectivity, HDI, Wire-to-Board, Fully Shrouded, Header: https://www.te.com/usa-en/product-440055-2.datasheet.pdf
- Pads
- 2
- THT
- 7.0×10.7
- Boards
- —
Converter_ACDC_Hi-Link_HLK-12MxxA
Converter_ACDC
ACDC-Converter, 12W, Hi-Link, HLK-12MxxA, THT, https://h.hlktech.com/download/ACDC%E7%94%B5%E6%BA%90%E6%A8%A1%E5%9D%9712W%E7%B3%BB%E5%88%97/1/12W%E7%B3%BB%E5%88%97%E8%A7%84%E6%A0%BC%E4%B9%A6.pdf
- Pads
- 4
- THT
- 53.3×27.9
- Boards
- —
Heatsink_AAVID_Extruded_531002B02100G_34.9x12.7mm_H25.4mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 25.4mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531002B02500G_34.9x12.7mm_H25.4mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐220, 25.4mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531102B00000G_34.9x12.7mm_H38.1mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 38.1mm height, no pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- —
- Mount
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531102B02100G_34.9x12.7mm_H38.1mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531102B02500G_34.9x12.7mm_H38.1mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531102V02500G_34.9x12.7mm_H38.1mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, AavSHIELD3 finish, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531202B00000G_34.9x12.7mm_H50.8mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, no pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- —
- Mount
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531202B02100G_34.9x12.7mm_H50.8mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531202B02500G_34.9x12.7mm_H50.8mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —
Heatsink_AAVID_Extruded_531302B02500G_34.9x12.7mm_H63.5mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 63.5mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
- Pads
- 1
- THT
- 36.0×14.0
- Boards
- —