Footprints
711 footprints matching “50”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Mounting_Wuerth_WA-SMST-3.3mm_H5mm_9774050960
Mounting_Wuerth
Mounting Hardware, inside through hole 3.3mm, height 5, Wuerth electronics 9774050960 (https://www.we-online.com/components/products/datasheet/9774050960R.pdf)
- Pads
- 1
- SMD
- 7.9×7.9
- Boards
- —
Mounting_Wuerth_WA-SMST-4.5mm_H5mm_9774050982
Mounting_Wuerth
Mounting Hardware, inside through hole 4.5mm, height 5, Wuerth electronics 9774050982 (https://www.we-online.com/components/products/datasheet/9774050982R.pdf)
- Pads
- 1
- SMD
- 9.9×9.9
- Boards
- —
FPC_1x22_P0.5mm
muratovas-MAS_Package_nostd
Molex FFC/FPC connector, 50 bottom-side contacts, 0.5mm pitch
- Pads
- 22
- SMD
- 11.5×3.6
- Boards
- —
L_Vishay_IHLP-5050CE
muratovas-MAS_Package_nostd
Inductor, Vishay, IHLP series, 12.9mmx13.2mm
- Pads
- 2
- SMD
- 15.2×13.6
- Boards
- —
AMS_TSL2550_SMD
OptoDevice
http://ams.com/eng/content/download/250130/975613/142977
- Pads
- 4
- SMD
- 4.3×3.1
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
DIP-10_W8.89mm_SMDSocket_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 10
- SMD
- 12.5×13.3
- Boards
- —
DIP-18_W8.89mm_SMDSocket_LongPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 18
- SMD
- 12.5×23.5
- Boards
- —
DIP-22_W11.43mm_SMDSocket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 11.43mm (450 mils), SMDSocket, LongPads
- Pads
- 22
- SMD
- 15.0×28.6
- Boards
- —
DIP-22_W8.89mm_SMDSocket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 22
- SMD
- 12.5×28.6
- Boards
- —
DIP-24_W11.43mm_SMDSocket_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 11.43mm (450 mils), SMDSocket, LongPads
- Pads
- 24
- SMD
- 15.0×31.1
- Boards
- —
DIP-24_W16.51mm_SMDSocket_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads
- Pads
- 24
- SMD
- 20.1×31.1
- Boards
- —
DIP-24_W8.89mm_SMDSocket_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 24
- SMD
- 12.5×31.1
- Boards
- —
DIP-32_W16.51mm_SMDSocket_LongPads
Package_DIP
32-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads
- Pads
- 32
- SMD
- 20.1×41.3
- Boards
- —
DIP-40_W16.51mm_SMDSocket_LongPads
Package_DIP
40-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads
- Pads
- 40
- SMD
- 20.1×51.4
- Boards
- —
DIP-40_W26.67mm_SMDSocket_LongPads
Package_DIP
40-lead though-hole mounted DIP package, row spacing 26.67mm (1050 mils), SMDSocket, LongPads
- Pads
- 40
- SMD
- 30.3×51.4
- Boards
- —
DIP-42_W16.51mm_SMDSocket_LongPads
Package_DIP
42-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads
- Pads
- 42
- SMD
- 20.1×54.0
- Boards
- —
DIP-48_W16.51mm_SMDSocket_LongPads
Package_DIP
48-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads
- Pads
- 48
- SMD
- 20.1×61.6
- Boards
- —
DIP-5-6_W8.89mm_SMDSocket_LongPads
Package_DIP
5-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads
- Pads
- 5
- SMD
- 12.5×8.3
- Boards
- —
DIP-64_W16.51mm_SMDSocket_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads
- Pads
- 64
- SMD
- 20.1×81.9
- Boards
- —
DIP-64_W24.13mm_SMDSocket_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 24.13mm (950 mils), SMDSocket, LongPads
- Pads
- 64
- SMD
- 27.7×81.9
- Boards
- —
DIP-64_W26.67mm_SMDSocket_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 26.67mm (1050 mils), SMDSocket, LongPads
- Pads
- 64
- SMD
- 30.3×81.9
- Boards
- —
TSSOP-50_4.4x12.5mm_P0.5mm
Package_SO
TSSOP, 50 Pin (JEDEC MO-153 Var BF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 50
- SMD
- 7.7×13.0
- Boards
- —
Relay_3PST_COTO_3650
Relay_THT
Low thermal EMF 3PST-NO reed relay, 150V 0.25A, similar to 3660 but with independent shield, https://cotorelay.com/wp-content/uploads/2014/09/3600_series_reed_relay_datasheet.pdf
- Pads
- 9
- THT
- 31.0×17.3
- Boards
- —