Footprints

76 footprints matching “Dual”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

76 footprints · page 3 of 4

Matched by name and keywords. Search by meaning instead

Wuerth_WR-PHD_61302625721_Standard_2x13_P2.54mm_Vertical

FP3D

Connector_Wuerth

Connector Wuerth, WR-PHD 2.54mm Dual Socket Header Bottom Entry Standard, Wuerth electronics 61302625721 (https://katalog.we-online.de/em/datasheet/61302625721.pdf)

Pads
26
THT
7.4×34.5
Boards
—

Wuerth_WR-PHD_613032216921_Large_2x16_P2.54mm_Vertical

FP3D

Connector_Wuerth

Connector Wuerth, WR-PHD 2.54mm Dual Socket Header Bottom Entry Large, Wuerth electronics 613032216921 (https://katalog.we-online.de/em/datasheet/613032216921.pdf)

Pads
32
THT
10.3×42.1
Boards
—

Wuerth_WR-PHD_61303225721_Standard_2x16_P2.54mm_Vertical

FP3D

Connector_Wuerth

Connector Wuerth, WR-PHD 2.54mm Dual Socket Header Bottom Entry Standard, Wuerth electronics 61303225721 (https://katalog.we-online.de/em/datasheet/61303225721.pdf)

Pads
32
THT
7.4×42.1
Boards
—

Wuerth_WR-PHD_613034216921_Large_2x17_P2.54mm_Vertical

FP3D

Connector_Wuerth

Connector Wuerth, WR-PHD 2.54mm Dual Socket Header Bottom Entry Large, Wuerth electronics 613034216921 (https://katalog.we-online.de/em/datasheet/613034216921.pdf)

Pads
34
THT
10.3×44.7
Boards
—

Wuerth_WR-PHD_61303425721_Standard_2x17_P2.54mm_Vertical

FP3D

Connector_Wuerth

Connector Wuerth, WR-PHD 2.54mm Dual Socket Header Bottom Entry Standard, Wuerth electronics 61303425721 (https://katalog.we-online.de/em/datasheet/61303425721.pdf)

Pads
34
THT
7.4×44.7
Boards
—

Converter_DCDC_Artesyn_ATA_SMD

FP3D

Converter_DCDC

DCDC-Converter, Artesyn, ATA Series, 3W Single and Dual Output, 1500VDC Isolation, 24.0x13.7x8.0mm https://www.artesyn.com/power/assets/ata_series_ds_01apr2015_79c25814fd.pdf https://www.artesyn.com/power/assets/trn_dc-dc_ata_3w_series_releas1430412818_techref.pdf

Pads
7
SMD
19.8×24.5
Boards
—

Converter_DCDC_Cincon_EC5BExx_Dual_THT

FP3D

Converter_DCDC

DCDC-Converter, CINCON, EC5BExx, 18-36VDC to Dual output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/B%20CASE/SPEC-EC5BE-V24.pdf

Pads
6
THT
25.9×51.3
Boards
—

Converter_DCDC_Cincon_EC5BExx_Single_THT

FP3D

Converter_DCDC

DCDC-Converter, CINCON, EC5BExx, 18-36VDC to dual output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/B%20CASE/SPEC-EC5BE-V24.pdf

Pads
4
THT
25.9×51.3
Boards
—

Converter_DCDC_Cincon_EC6Cxx_Dual-Triple_THT

FP3D

Converter_DCDC

DCDC-Converter, CINCON, EC6Cxx, dual or tripple output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/C%20CASE/SPEC-EC6C-V12.pdf

Pads
7
THT
52.2×51.3
Boards
—

Converter_DCDC_TRACO_TEN10-xxxx_Dual_THT

FP3D

Converter_DCDC

DCDC-Converter, TRACO, TEN10-xxxx, single output, https://assets.tracopower.com/20171102100522/TEN10/documents/ten10-datasheet.pdf

Pads
5
THT
25.9×51.3
Boards
—

Converter_DCDC_XP_POWER-ISU02_SMD

FP3D

Converter_DCDC

DCDC-Converter, XP POWER, ISU02 Series, 2W Single and Dual Output, 1500VDC Isolation, 19.0x17.0x8.7mm https://www.xppower.com/Portals/0/pdfs/SF_ISU02.pdf

Pads
7
SMD
19.1×19.5
Boards
—

Heatsink_AAVID_Extruded_531002B02100G_34.9x12.7mm_H25.4mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 25.4mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531002B02500G_34.9x12.7mm_H25.4mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 25.4mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531102B00000G_34.9x12.7mm_H38.1mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 38.1mm height, no pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
—
Mount
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531102B02100G_34.9x12.7mm_H38.1mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531102B02500G_34.9x12.7mm_H38.1mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531102V02500G_34.9x12.7mm_H38.1mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, AavSHIELD3 finish, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531202B00000G_34.9x12.7mm_H50.8mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, no pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
—
Mount
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531202B02100G_34.9x12.7mm_H50.8mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531202B02500G_34.9x12.7mm_H50.8mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 50.8mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Heatsink_AAVID_Extruded_531302B02500G_34.9x12.7mm_H63.5mm

FP3D

Heatsink

Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 63.5mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf

Pads
1
THT
36.0×14.0
Boards
—

Sipeed-M1

FP3D

Module

MAIX Dual Core RISC-V MCU, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications

Pads
72
SMD
27.0×27.0
Boards
—

Sipeed-M1W

FP3D

Module

MAIX RISC-V Dual Core MCU with wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications

Pads
72
SMD
27.0×27.0
Boards
—

Relay_DPDT_Kemet_EE2_NUH_DoubleCoil

FP3D

Relay_SMD

Kemet signal relay, DPDT, double coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf

Pads
10
SMD
8.8×15.5
Boards
—