Footprints

401 footprints matching “0.5”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

401 footprints · page 1 of 17

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LQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

LQFP, 48 Pin (JEDEC MS-026 variation BBC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfp/05081760_a_lx48.pdf)

Pads: 48
SMD: 10.3×10.3
Boards: 862

LQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7606_7606-6_7606-4.pdf)

Pads: 64
SMD: 13.4×13.4
Boards: 663

MSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

MSOP, 10 Pin (JEDEC MO-187 variation BA, 0.85mm body thickness, https://www.jedec.org/system/files/docs/mo-187F.pdf)

Pads: 10
SMD: 6.2×3.5
Boards: 333

LQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

LQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf)

Pads: 100
SMD: 17.5×17.5
Boards: 273

QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)

Pads: 25
SMD: 5.2×5.2
Boards: 256

R_Axial_DIN0309_L9.0mm_D3.2mm_P12.70mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0309 series, Axial, Horizontal, pin pitch=12.7mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads: 2
THT: 14.8×3.7
Boards: 230

QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: 176

QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)

Pads: 29
SMD: 6.2×6.2
Boards: 175

CP_Elec_10x10.5

FP3D

Capacitor_SMD

SMD capacitor, aluminum electrolytic, Vishay 1010, 10.0x10.5mm, http://www.vishay.com/docs/28395/150crz.pdf

Pads: 2
SMD: 13.3×11.0
Boards: 157

VSSOP-8_2.3x2mm_P0.5mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads: 8
SMD: 4.6×2.5
Boards: 156

TSSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)

Pads: 10
SMD: 6.3×3.5
Boards: 153

LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y

FP3D

Package_LGA

LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf)

Pads: 14
SMD: 3.5×3.0
Boards: 118

QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)

Pads: 21
SMD: 5.2×5.2
Boards: 115

LGA-12_2x2mm_P0.5mm

FP3D

Package_LGA

LGA12

Pads: 12
SMD: 2.5×2.5
Boards: 115

Converter_DCDC_RECOM_R-78E-0.5_THT

FP3D

Converter_DCDC

DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Exx-0.5.pdf

Pads: 3
THT: 12.1×9.0
Boards: 111

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads: 144
SMD: 23.3×23.3
Boards: 104

CP_Elec_8x10.5

FP3D

Capacitor_SMD

SMD capacitor, aluminum electrolytic, Vishay 0810, 8.0x10.5mm, http://www.vishay.com/docs/28395/150crz.pdf

Pads: 2
SMD: 12.3×9.0
Boards: 102

TQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)

Pads: 100
SMD: 17.3×17.3
Boards: 93

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 87

TQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=666)

Pads: 48
SMD: 10.3×10.3
Boards: 85

USON-10_2.5x1.0mm_P0.5mm

FP3D

Package_SON

USON-10 2.5x1.0mm_ Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf

Pads: 10
SMD: 1.8×3.0
Boards: 84

R_Axial_DIN0309_L9.0mm_D3.2mm_P15.24mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0309 series, Axial, Horizontal, pin pitch=15.24mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads: 2
THT: 17.3×3.7
Boards: 64