Footprints

177 footprints matching “36

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

177 footprints · page 1 of 8

Matched by name and keywords. Search by meaning instead

SOT-363_SC-70-6

FP3D

Package_TO_SOT_SMD

SOT, 6 Pin (https://home.jeita.or.jp/tsc/std-pdf/ED-7500A.pdf#page=170, JEDEC MO-203, variant AB, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203)

Pads
6
SMD
2.9×2.2
Boards
586

SW_Tactile_SPST_NO_Straight_CK_PTS636Sx25SMTRLFS

FP3D

Button_Switch_SMD

Tactile switch, SPST, 6.0x3.5 mm, H2.5 mm, straight, NO, gull wing leads: https://www.ckswitches.com/media/2779/pts636.pdf

Pads
2
SMD
9.5×4.2
Boards
90

Relay_SPDT_Finder_36.11

FP3D

Relay_THT

FINDER 36.11, SPDT relay, 10A, https://cdn.findernet.com/app/uploads/S36EN.pdf

Pads
5
THT
15.7×19.3
Boards
53

QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm

FP3D

Package_DFN_QFN

QFN, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf)

Pads
37
SMD
7.2×7.2
Boards
40

SW_PUSH_1P1T_6x3.5mm_H4.3_APEM_MJTP1243

FP3D

Button_Switch_THT

tactile push button, 6x3.5mm, https://www.apem.com/idec-apem/en_US/PCB-switches/Tactile-Switches/MJTP-6mm-through-hole/c/MJTP_6mm_through%20hole?page=1

Pads
2
THT
9.3×4.0
Boards
22

CP_EIA-7361-38_AVX-V

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD AVX-V (7361-38 Metric), IPC-7352 nominal, (Body size from: http://datasheets.avx.com/NOS.pdf)

Pads
2
SMD
8.7×6.6
Boards
11

LairdTech_28C0236-0JW-10

FP3D

Ferrite_THT

Ferrite, vertical, LairdTech 28C0236-0JW-10, https://assets.lairdtech.com/home/brandworld/files/28C0236-0JW-10.pdf, JW Miller core https://www.bourns.com/products/magnetic-products/j.w.-miller-through-hole-ferrite-beads-emi-filters

Pads
2
THT
7.9×7.9
Boards
11

PinSocket_1x36_P2.54mm_Vertical

FP3D

Connector_PinSocket_2.54mm

Through hole straight socket strip, 1x36, 2.54mm pitch, single row (from Kicad 4.0.7), script generated

Pads
36
THT
3.5×92.4
Boards
10

D_2114_3652Metric_Pad1.85x3.75mm_HandSolder

FP3D

Diode_SMD

Diode SMD 2114 (3652 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/schottky.pdf)

Pads
2
SMD
6.9×4.3
Boards
10

SW_PUSH_1P1T_6x3.5mm_H5.0_APEM_MJTP1250

FP3D

Button_Switch_THT

tactile push button, 6x3.5mm, https://www.apem.com/idec-apem/en_US/PCB-switches/Tactile-Switches/MJTP-6mm-through-hole/c/MJTP_6mm_through%20hole?page=1

Pads
2
THT
9.3×4.0
Boards
9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads
33
SMD
9.0×11.6
Boards
9

L_Wuerth_HCI-1365

FP3D

Inductor_SMD

Inductor, Wuerth, HCI-1365, 12.8x12.8x6.2mm, (https://www.we-online.com/components/products/datasheet/744355122.pdf)

Pads
2
SMD
15.5×13.3
Boards
8

PinHeader_1x36_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 1x36, 2.54mm pitch, single row

Pads
36
THT
3.5×92.4
Boards
7

Texas_RHH0036C_VQFN-36-1EP_6x6mm_P0.5mm_EP4.4x4.4mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RHH0036C VQFN, 36 Pin (http://www.ti.com/lit/ds/slvsba5d/slvsba5d.pdf#page=37)

Pads
37
SMD
7.3×7.3
Boards
6

CP_EIA-7360-38_Kemet-E

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD Kemet-E (7360-38 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)

Pads
2
SMD
8.8×6.5
Boards
4

PinSocket_2x36_P2.54mm_Vertical

FP3D

Connector_PinSocket_2.54mm

Through hole straight socket strip, 2x36, 2.54mm pitch, double rows (from Kicad 4.0.7), script generated

Pads
72
THT
6.1×92.4
Boards
4

D_2114_3652Metric

FP3D

Diode_SMD

Diode SMD 2114 (3652 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/schottky.pdf)

Pads
2
SMD
6.6×4.3
Boards
4

PinHeader_1x36_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 1x36, 2.54mm pitch, 6mm pin length, single row

Pads
36
THT
12.3×92.4
Boards
3

PinHeader_2x36_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x36, 2.54mm pitch, double rows

Pads
72
THT
6.1×92.4
Boards
3

L_Chilisin_BMRG00131360

FP3D

Inductor_SMD

Inductor, Chilisin, BMRG00131360, 13.8x12.6x6.0mm, (https://www.chilisin.com/upload/media/product/power/file/BMRx_Series.pdf)

Pads
2
SMD
15.0×13.1
Boards
3

MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm

FP3D

Package_SO

MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)

Pads
9
SMD
6.2×3.5
Boards
3

CP_EIA-7361-438_AVX-U

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD AVX-U (7361-438 Metric), IPC-7352 nominal, (Body size from: http://datasheets.avx.com/NOS.pdf)

Pads
2
SMD
8.7×6.6
Boards
2

QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf)

Pads
37
SMD
7.2×7.2
Boards
2

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads
33
SMD
9.0×11.6
Boards
2