Footprints

8 footprints matching “DSBGA

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

8 footprints

Matched by name and keywords. Search by meaning instead

Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads
8
SMD
2.9×3.9
Boards
3

Texas_DSBGA-8_0.705x1.468mm_Layout2x4_P0.4mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, NSMD, YBJ0008 pad definition, 0.705x1.468mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234

Pads
8
SMD
2.7×3.5
Boards
2

Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf

Pads
12
SMD
3.4×3.9
Boards
1

Texas_DSBGA-10_1.36x1.86mm_Layout3x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf

Pads
10
SMD
3.4×3.9
Boards

Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm

FP3D

Package_BGA

Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf

Pads
12
SMD
4.1×3.6
Boards

Texas_DSBGA-49_3.33x3.488mm_Layout7x7_P0.4mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, 3.33x3.488mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf

Pads
49
SMD
5.3×5.5
Boards

Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm

FP3D

Package_BGA

Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf

Pads
6
SMD
2.8×3.0
Boards

WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm

FP3D

Package_CSP

ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23

Pads
6
SMD
3.5×3.1
Boards