Footprints
15 footprints matching “Grid”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Bosch_LGA-8_2.5x2.5mm_P0.65mm_ClockwisePinNumbering
Package_LGA
LGA-8
- Pads
- 8
- SMD
- 2.8×3.1
- Boards
- 118
LGA-12_2x2mm_P0.5mm
Package_LGA
LGA12
- Pads
- 12
- SMD
- 2.5×2.5
- Boards
- 115
Bosch_LGA-8_2x2.5mm_P0.65mm_ClockwisePinNumbering
Package_LGA
LGA-8, https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMP280-DS001-18.pdf
- Pads
- 8
- SMD
- 3.1×2.6
- Boards
- 101
Bosch_LGA-14_3x2.5mm_P0.5mm
Package_LGA
LGA-14 Bosch https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMI160-DS000-07.pdf
- Pads
- 14
- SMD
- 3.7×3.2
- Boards
- 60
LGA-8_3x5mm_P1.25mm
Package_LGA
LGA-8
- Pads
- 8
- SMD
- 3.6×5.5
- Boards
- 55
LGA-16_3x3mm_P0.5mm
Package_LGA
http://www.memsic.com/userfiles/files/DataSheets/Magnetic-Sensors-Datasheets/MMC5883MA-RevC.pdf
- Pads
- 16
- SMD
- 3.5×3.5
- Boards
- 26
Texas_DSBGA-8_0.705x1.468mm_Layout2x4_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, NSMD, YBJ0008 pad definition, 0.705x1.468mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234
- Pads
- 8
- SMD
- 2.7×3.5
- Boards
- 2
Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 12
- SMD
- 3.4×3.9
- Boards
- 1
AMS_LGA-10-1EP_2.7x4mm_P0.6mm
Package_LGA
LGA-10, http://ams.com/eng/content/download/951091/2269479/471718
- Pads
- 11
- SMD
- 3.0×4.3
- Boards
- 1
LGA-12_2x2mm_P0.5mm
muratovas-MAS_Package_std
LGA12
- Pads
- 12
- SMD
- 2.5×2.5
- Boards
- —
Texas_DSBGA-10_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf
- Pads
- 10
- SMD
- 3.4×3.9
- Boards
- —
Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf
- Pads
- 12
- SMD
- 4.1×3.6
- Boards
- —
Texas_DSBGA-49_3.33x3.488mm_Layout7x7_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, 3.33x3.488mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 49
- SMD
- 5.3×5.5
- Boards
- —
Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 12
- SMD
- 4.5×4.0
- Boards
- —
Texas_MicroStar_Junior_BGA-80_5.0x5.0mm_Layout9x9_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 80
- SMD
- 6.0×6.0
- Boards
- —