Footprints

1,509 footprints matching “2mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,509 footprints · page 12 of 63

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MountingHole_2.2mm_M2_ISO14580_Pad_TopBottom

FP—

MountingHole

Mounting Hole 2.2mm, M2, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 4.3×4.3
Boards: 8

R_LDR_5.2x5.2mm_P3.5mm_Horizontal

FP3D

OptoDevice

Resistor, LDR 5.2x5.2, upright, see http://cdn-reichelt.de/documents/datenblatt/A500/M996011A.pdf

Pads: 2
THT: 6.0×2.2
Boards: 8

DFN-6-1EP_3x2mm_P0.5mm_EP1.65x1.35mm

FP—

Package_DFN_QFN

DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/(DCB6)%20DFN%2005-08-1715%20Rev%20A.pdf)

Pads: 7
SMD: 4.2×2.5
Boards: 8

DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.3mm

FP—

Package_DFN_QFN

DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/NB3N551-D.PDF#page=7)

Pads: 9
SMD: 3.2×2.5
Boards: 8

LQFP-80_12x12mm_P0.5mm

FP3D

Package_QFP

LQFP, 80 Pin (https://www.nxp.com/docs/en/package-information/SOT315-1.pdf)

Pads: 80
SMD: 15.4×15.4
Boards: 8

SOIC-8_5.3x6.2mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (Texas Instruments (based on JEITA/EIAJ 08-001-BBA), 208 mils width, https://www.ti.com/lit/ml/msop001a/msop001a.pdf)

Pads: 8
SMD: 9.4×6.7
Boards: 8

TerminalBlock_MetzConnect_Type059_RT06305HBWC_1x05_P3.50mm_Horizontal

FP—

TerminalBlock_MetzConnect

terminal block Metz Connect Type059_RT06305HBWC, 5 pins, pitch 3.5mm, size 17.5x6.5mm, drill diameter 1.2mm, pad diameter 2.3mm, https://www.metz-connect.com/externalfiles/310591/863246.PDF

Pads: 5
THT: 18.5×7.5
Boards: 8

TerminalBlock_Phoenix_MPT-0,5-10-2.54_1x10_P2.54mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MPT-0,5-10-2.54, 10 pins, pitch 2.54mm, size 25.9x6.2mm, drill diameter 1.1mm, pad diameter 2.2mm, http://www.mouser.com/ds/2/324/ItemDetail_1725672-916605.pdf

Pads: 10
THT: 26.9×7.2
Boards: 8

TerminalBlock_Phoenix_PT-1,5-8-3.5-H_1x08_P3.50mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-8-3.5-H, 8 pins, pitch 3.5mm, size 28x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,

Pads: 8
THT: 29.0×8.6
Boards: 8

SW_DIP_SPSTx03_Slide_KingTek_DSHP03TS_W7.62mm_P1.27mm

FP3D

Button_Switch_SMD

SMD 3x-dip-switch SPST KingTek_DSHP03TS, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf)

Pads: 6
SMD: 9.4×6.0
Boards: 7

SW_DIP_SPSTx02_Piano_10.8x6.64mm_W7.62mm_P2.54mm

FP3D

Button_Switch_THT

2x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x6.64mm

Pads: 4
THT: 13.1×7.3
Boards: 7

SW_DIP_SPSTx04_Piano_10.8x11.72mm_W7.62mm_P2.54mm

FP3D

Button_Switch_THT

4x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm

Pads: 8
THT: 13.1×12.3
Boards: 7

Crystal_SMD_SeikoEpson_MC306-4Pin_8.0x3.2mm_HandSoldering

FP—

Crystal

Seiko Epson MC-306, Crystal, 8.0x3.2mm package, SMD, hand-soldering, https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf

Pads: 4
SMD: 9.0×7.5
Boards: 7

MountingHole_2.2mm_M2_ISO7380_Pad_TopOnly

FP—

MountingHole

Mounting Hole 2.2mm, M2, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 4.0×4.0
Boards: 7

MountingHole_2.2mm_M2_Pad_TopOnly

FP—

MountingHole

Mounting Hole 2.2mm, M2, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 4.9×4.9
Boards: 7

MountingHole_3.2mm_M3_ISO7380_Pad_TopOnly

FP—

MountingHole

Mounting Hole 3.2mm, M3, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 6.2×6.2
Boards: 7

Broadcom_DFN-6_2x2mm_P0.65mm

FP—

OptoDevice

Broadcom DFN, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN)

Pads: 6
SMD: 3.3×2.5
Boards: 7

Oscillator_SMD_Abracon_ASCO-4Pin_1.6x1.2mm

FP—

Oscillator

Miniature Crystal Clock Oscillator Abracon ASCO series, https://abracon.com/Oscillators/ASCO.pdf, 1.6x1.2mm^2 package

Pads: 4
SMD: 1.8×2.2
Boards: 7

DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/506AQ.PDF)

Pads: 9
SMD: 3.2×2.5
Boards: 7

DIP-4_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 4
SMD: 10.7×5.7
Boards: 7

DIP-6_W7.62mm_Socket_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 6
THT: 10.7×8.2
Boards: 7

LGA-14_2x2mm_P0.35mm_LayoutBorder3x4y

FP3D

Package_LGA

LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lis2dh12.pdf)

Pads: 14
SMD: 2.2×2.2
Boards: 7

PQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

PQFP, 44 Pin (JEDEC MS-022 variation AB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-21291a.pdf)

Pads: 44
SMD: 14.5×14.5
Boards: 7

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 21
SMD: 7.9×7.1
Boards: 7