Footprints

1,939 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,939 footprints · page 12 of 81

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DIP-22_W10.16mm

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 22
THT: 12.3×28.4
Boards: 1

DIP-22_W10.16mm_Socket

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket

Pads: 22
THT: 13.2×28.6
Boards: 1

DIP-22_W7.62mm_Socket

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 22
THT: 10.7×28.6
Boards: 1

DIP-24_18.0mmx34.29mm_W15.24mm

FP—

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils) https://www.mouser.at/datasheet/2/389/m48t02-1849963.pdf

Pads: 24
THT: 18.5×34.8
Boards: 1

DIP-24_W10.16mm

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 24
THT: 12.3×31.0
Boards: 1

DIP-28_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 28
SMD: 20.1×36.2
Boards: 1

DIP-28_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 28
SMD: 12.5×36.2
Boards: 1

DIP-40_W25.4mm_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), LongPads

Pads: 40
THT: 28.3×51.3
Boards: 1

DIP-40_W25.4mm_Socket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), Socket, LongPads

Pads: 40
THT: 28.4×51.4
Boards: 1

DIP-42_W15.24mm_Socket_LongPads

FP3D

Package_DIP

42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 42
THT: 18.3×54.0
Boards: 1

DIP-5-6_W7.62mm

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils)

Pads: 5
THT: 9.8×8.2
Boards: 1

TQFP-144_16x16mm_P0.4mm

FP3D

Package_QFP

144-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 144
SMD: 19.4×19.4
Boards: 1

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_ThermalVias

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads: 21
SMD: 7.9×7.1
Boards: 1

SSO-4_6.7x5.1mm_P2.54mm_Clearance8mm

FP3D

Package_SO

4-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf

Pads: 4
SMD: 11.9×5.6
Boards: 1

SSO-6_6.8x4.6mm_P1.27mm_Clearance8mm

FP3D

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads: 6
SMD: 13.1×5.1
Boards: 1

SSO-8_6.8x5.9mm_P1.27mm_Clearance7mm

FP3D

Package_SO

Pads: 8
SMD: 11.2×6.4
Boards: 1

Infineon_PG-TO-220-7Lead_TabPin8

FP3D

Package_TO_SOT_SMD

Infineon PG-TO-220-7, Tab as Pin 8, see e.g. https://www.infineon.com/dgdl/Infineon-BTS50055-1TMC-DS-v01_00-EN.pdf?fileId=5546d4625a888733015aa9b0007235e9

Pads: 8
SMD: 16.7×11.3
Boards: 1

TO-92_Horizontal2

FP—

Package_TO_SOT_THT

TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×11.3
Boards: 1

TO-92-2_Wide

FP3D

Package_TO_SOT_THT

TO-92 2-pin leads in-line, wide, drill 0.75mm

Pads: 2
THT: 7.1×4.7
Boards: 1

InvenSense_QFN-24_3x3mm_P0.4mm_NoMask

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 4.1×4.1
Boards: 1