Footprints

1,552 footprints matching “CE”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,552 footprints · page 15 of 65

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Resonator_SMD-3Pin_7.2x3.0mm_HandSoldering

FP3D

Crystal

Murata CSTCC8M00G53-R0, Resonator/Filter, 8MHz, 7.2x3.0mm package, SMD, hand-soldering, http://www.farnell.com/datasheets/19296.pdf?_ga=1.247244932.122297557.1475167906

Pads: 3
SMD: 10.1×4.3
Boards: 1

L_Cenker_CKCS4018

FP3D

Inductor_SMD

Inductor, Cenker, CKCS4018, 4.0x4.0x1.8mm, (https://www.ckcoil.com/file/upload/spae532/2023-07/11/202307110955366446.pdf)

Pads: 2
SMD: 4.9×4.5
Boards: 1

L_Cenker_CKCS4030

FP3D

Inductor_SMD

Inductor, Cenker, CKCS4030, 4.0x4.0x3.0mm, (https://www.ckcoil.com/file/upload/spae532/2023-07/11/202307110955366446.pdf)

Pads: 2
SMD: 5.1×4.5
Boards: 1

L_Cenker_CKCS5020

FP3D

Inductor_SMD

Inductor, Cenker, CKCS5020, 5.0x5.0x2.1mm, (https://www.ckcoil.com/file/upload/spae532/2023-07/11/202307110955366446.pdf)

Pads: 2
SMD: 6.0×5.5
Boards: 1

L_Cenker_CKCS6020

FP3D

Inductor_SMD

Inductor, Cenker, CKCS6020, 6.0x6.0x2.1mm, (https://www.ckcoil.com/file/upload/spae532/2023-07/11/202307110955366446.pdf)

Pads: 2
SMD: 7.1×6.5
Boards: 1

L_CommonMode_Delevan_4222

FP—

Inductor_SMD

API Delevan, Surface Mount Common Mode Bead, 4222 4222R, http://www.delevan.com/seriesPDFs/4222.pdf

Pads: 4
SMD: 11.0×6.1
Boards: 1

Broadcom_AFBR-16xxZ_Horizontal

FP3D

OptoDevice

Fiber Optic Transmitter and Receiver, https://docs.broadcom.com/docs/AV02-4369EN

Pads: 6
THT: 18.2×12.2
Boards: 1

Broadcom_AFBR-16xxZ_Vertical

FP3D

OptoDevice

Fiber Optic Transmitter and Receiver, https://docs.broadcom.com/docs/AV02-4369EN

Pads: 6
THT: 18.6×12.9
Boards: 1

Vishay_TCRT5000

FP3D

OptoDevice

IR Reflective Optical Sensor with Transistor Output TCRT5000 https://www.vishay.com/docs/83760/tcrt5000.pdf

Pads: 4
THT: 10.9×6.5
Boards: 1

Alliance_TFBGA-54_8x8mm_Layout9x9_P0.8mm

FP—

Package_BGA

Alliance TFBGA 54 pins, 8x8mm, 54 Ball, 9x9 Layout, 0.8mm Pitch, https://www.alliancememory.com/wp-content/uploads/pdf/dram/Alliance_Memory_64M-AS4C4M16SA-CI_v5.0_October_2018.pdf#page=54

Pads: 54
SMD: 10.0×10.0
Boards: 1

Lattice_caBGA-381_17x17mm_Layout20x20_P0.8mm

FP—

Package_BGA

Lattice caBGA-381, ECP5 FPGAs, 17.0x17.0mm, 381 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213

Pads: 381
SMD: 19.0×19.0
Boards: 1

CERDIP-14_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 10.5×19.6
Boards: 1

CERDIP-16_W7.62mm_SideBrazed

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 16
THT: 9.7×20.8
Boards: 1

CERDIP-16_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 16
THT: 10.7×20.9
Boards: 1

CERDIP-18_W7.62mm_SideBrazed

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 18
THT: 9.7×23.4
Boards: 1

CERDIP-20_W7.62mm_SideBrazed

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 20
THT: 9.7×25.9
Boards: 1

CERDIP-20_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 20
THT: 10.5×25.9
Boards: 1

CERDIP-20_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 20
THT: 10.7×26.0
Boards: 1

SSO-4_6.7x5.1mm_P2.54mm_Clearance8mm

FP3D

Package_SO

4-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf

Pads: 4
SMD: 11.9×5.6
Boards: 1

SSO-6_6.8x4.6mm_P1.27mm_Clearance8mm

FP3D

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads: 6
SMD: 13.1×5.1
Boards: 1