Footprints

1,517 footprints matching “pads”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,517 footprints · page 15 of 64

Matched by name and keywords. Search by meaning instead

TerminalBlock_RND_205-00018_1x08_P5.00mm_Horizontal

FP—

TerminalBlock_RND

terminal block RND 205-00018, 8 pins, pitch 5mm, size 40x7.6mm, drill diameter 1.3mm, pad diameter 2.5mm, http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00012_DB_EN.pdf

Pads: 8
THT: 41.0×8.6
Boards: 4

TerminalBlock_RND_205-00045_1x02_P5.00mm_Horizontal

FP—

TerminalBlock_RND

terminal block RND 205-00045, 2 pins, pitch 5mm, size 10x8.1mm, drill diameter 1.1mm, pad diameter 2.1mm, http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00045_DB_EN.pdf

Pads: 2
THT: 11.0×9.1
Boards: 4

TerminalBlock_RND_205-00238_1x08_P5.08mm_Horizontal

FP—

TerminalBlock_RND

terminal block RND 205-00238, 8 pins, pitch 5.08mm, size 40.6x8.45mm, drill diameter 1.1mm, pad diameter 2.1mm, http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf

Pads: 8
THT: 41.6×9.4
Boards: 4

TerminalBlock_TE_1-282834-2_1x12_P2.54mm_Horizontal

FP—

TerminalBlock_TE-Connectivity

Terminal Block TE 1-282834-2, 12 pins, pitch 2.54mm, size 30.9x6.5mm, drill diameter 1.1mm, pad diameter 2.1mm, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf

Pads: 12
THT: 31.9×7.5
Boards: 4

TerminalBlock_WAGO_236-102_1x02_P5.00mm_45Degree

FP—

TerminalBlock_WAGO

Terminal Block WAGO 236-102, 45Degree (cable under 45degree), 2 pins, pitch 5mm, size 12.3x14mm, drill diameter 1.15mm, pad diameter 3mm,

Pads: 2
THT: 13.3×15.0
Boards: 4

SolderWirePad_1x01_SMD_1.5x3mm

FP—

Connector_Wire

Wire Pad, Square, SMD Pad, 1.5mm x 3mm

Pads: 1
SMD: 2.0×3.5
Boards: 3

L_2010_5025Metric_Pad1.52x2.65mm_HandSolder

FP3D

Inductor_SMD

Inductor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 6.7×3.2
Boards: 3

MountingHole_4.3mm_M4_ISO14580_Pad_TopBottom

FP—

MountingHole

Mounting Hole 4.3mm, M4, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 7.5×7.5
Boards: 3

MountingHole_4mm_Pad_TopOnly

FP—

MountingHole

Mounting Hole 4mm, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 8.5×8.5
Boards: 3

MountingHole_5.5mm_Pad_Via

FP—

MountingHole

Mounting Hole 5.5mm, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 11.5×11.5
Boards: 3

MountingHole_5mm_Pad_TopOnly

FP—

MountingHole

Mounting Hole 5mm, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 10.5×10.5
Boards: 3

MountingHole_6.4mm_M6_Pad

FP—

MountingHole

Mounting Hole 6.4mm, M6, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 13.3×13.3
Boards: 3

MountingHole_8.4mm_M8_Pad_Via

FP—

MountingHole

Mounting Hole 8.4mm, M8, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 17.3×17.3
Boards: 3

Texas_DSBGA-6_0.95x1.488mm_Layout2x3_P0.4mm

FP—

Package_BGA

Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf

Pads: 6
SMD: 3.0×3.5
Boards: 3

Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 8
SMD: 2.9×3.9
Boards: 3

Texas_DSBGA-8_1.43x1.41mm_Layout3x3_P0.5mm

FP—

Package_BGA

Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 8
SMD: 3.4×3.4
Boards: 3

Texas_DSBGA-9_1.4715x1.4715mm_Layout3x3_P0.5mm

FP—

Package_BGA

Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 9
SMD: 3.5×3.5
Boards: 3

Xilinx_CSG324

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268

Pads: 324
SMD: 17.0×17.0
Boards: 3

Xilinx_FGG484

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 23x23mm, 484 Ball, 22x22 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275

Pads: 484
SMD: 25.0×25.0
Boards: 3

WQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm

FP—

Package_DFN_QFN

QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf)

Pads: 33
SMD: 5.9×5.9
Boards: 3

CERDIP-16_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 16
THT: 10.5×20.8
Boards: 3

CERDIP-28_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 28
THT: 10.7×36.2
Boards: 3