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Footprints

2,819 footprints matching “lead”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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SymbolFootprint3D model

Footprints on their own, whether or not a symbol uses them.

2,819 footprints · page 17 of 118

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Texas_RGE0024H_VQFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

Texas RGE0024H VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=40)

Pads
25
SMD
5.3×5.3
Boards
4

Texas_RGY_R-PVQFN-N16_EP2.05x2.55mm

FP—

Package_DFN_QFN

QFN, 16 Pin (https://www.ti.com/lit/ds/symlink/ts5v330.pdf#page=28)

Pads
17
SMD
4.8×5.3
Boards
4

Texas_RGY_R-PVQFN-N24_EP2.05x3.1mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40)

Pads
25
SMD
4.8×6.8
Boards
4

Texas_RHB0032E_VQFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RHB0032E VQFN, 32 Pin (http://www.ti.com/lit/ds/symlink/msp430f1122.pdf#page=54)

Pads
33
SMD
6.3×6.3
Boards
4

TQFN-16-1EP_3x3mm_P0.5mm_EP1.23x1.23mm_ThermalVias

FP—

Package_DFN_QFN

TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF)

Pads
17
SMD
4.2×4.2
Boards
4

TQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias

FP—

Package_DFN_QFN

TQFN, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-3))

Pads
33
SMD
6.2×6.2
Boards
4

VQFN-16-1EP_3x3mm_P0.5mm_EP1.1x1.1mm

FP—

Package_DFN_QFN

VQFN, 16 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/16L_VQFN-WFS_3x3mm_4MX_C04-00508a.pdf)

Pads
17
SMD
4.2×4.2
Boards
4

VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf)

Pads
21
SMD
4.2×4.2
Boards
4

WQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tlv9064.pdf#page=44)

Pads
17
SMD
4.3×4.3
Boards
4

WQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/ts3ds10224.pdf#page=29)

Pads
21
SMD
4.3×4.3
Boards
4

CERDIP-8_W7.62mm_SideBrazed

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
8
THT
9.7×13.7
Boards
4

CERDIP-8_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
8
THT
10.5×13.7
Boards
4

CERDIP-8_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
8
THT
10.7×13.8
Boards
4

DIP-10_W7.62mm_LongPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads
10
THT
10.5×13.2
Boards
4

DIP-12_W7.62mm

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads
12
THT
9.7×15.7
Boards
4

DIP-48_W15.24mm_LongPads

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads
48
THT
18.1×61.5
Boards
4

Vishay_HVM-DIP-3_W7.62mm

FP3D

Package_DIP

3-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf

Pads
3
THT
9.9×5.5
Boards
4

Analog_LCC-8_5x5mm_P1.27mm

FP3D

Package_LCC

LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf

Pads
8
SMD
6.3×6.4
Boards
4

AMS_OLGA-8_2x3.1mm_P0.8mm

FP—

Package_LGA

AMS OLGA, 8 Pin (https://ams.com/documents/20143/36005/AS7341_DS000504_3-00.pdf/#page=63)

Pads
8
SMD
2.5×3.6
Boards
4

SO-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

6-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads
6
SMD
8.8×4.1
Boards
4

SOIC-8-N7_3.9x4.9mm_P1.27mm

FP3D

Package_SO

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF)

Pads
7
SMD
7.5×5.4
Boards
4

SSO-8_6.7x9.8mm_P2.54mm_Clearance8mm

FP3D

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf

Pads
8
SMD
11.9×10.3
Boards
4

TSSOP-14-1EP_4.4x5mm_P0.65mm

FP3D

Package_SO

14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)

Pads
15
SMD
7.9×5.6
Boards
4

WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads
9
SMD
3.9×3.5
Boards
4